Issued Patents All Time
Showing 26–50 of 223 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10886137 | Selective nitride removal | Prerna Goradia, Yogita Pareek, Geetika Bajaj, Robert Jan Visser | 2021-01-05 |
| 10872778 | Systems and methods utilizing solid-phase etchants | Zhijun Chen, Chia-Ling Kao, Anchuan Wang | 2020-12-22 |
| 10861676 | Metal recess for semiconductor structures | Zhenjiang Cui, Feiyue Ma, Hanshen Zhang, Siliang Chang, Daniella Holm | 2020-12-08 |
| 10854426 | Metal recess for semiconductor structures | Zhenjiang Cui, Feiyue Ma, Hanshen Zhang, Siliang Chang, Daniella Holm | 2020-12-01 |
| 10825665 | Directional treatment for multi-dimensional device processing | Ludovic Godet, Huixiong Dai, Srinivas D. Nemani, Ellie Yieh | 2020-11-03 |
| 10796922 | Systems and methods for internal surface conditioning assessment in plasma processing equipment | Soonam Park, Yufei Zhu, Edwin C. Suarez, Dmitry Lubomirsky, Jiayin Huang | 2020-10-06 |
| 10770346 | Selective cobalt removal for bottom up gapfill | Xikun Wang, Jianxin Lei, Roey Shaviv | 2020-09-08 |
| 10755941 | Self-limiting selective etching systems and methods | Zhijun Chen, Chia-Ling Kao, Anchuan Wang | 2020-08-25 |
| 10727080 | Tantalum-containing material removal | Xikun Wang, Naomi Yoshida, Soumendra N. Barman | 2020-07-28 |
| 10707061 | Systems and methods for internal surface conditioning in plasma processing equipment | Soonam Park, Yufei Zhu, Edwin C. Suarez, Dmitry Lubomirsky, Jiayin Huang | 2020-07-07 |
| 10699953 | Method for creating a fully self-aligned via | Amrita B. Mullick, Xikun Wang, Regina Freed, Uday Mitra, Ho-yung David Hwang | 2020-06-30 |
| 10692880 | 3D NAND high aspect ratio structure etch | Zhenjiang Cui, Hanshen Zhang, Anchuan Wang, Zhijun Chen | 2020-06-23 |
| 10600639 | SiN spacer profile patterning | Jungmin Ko, Tom Choi, Kwang Soo Kim, Theodore Wou | 2020-03-24 |
| 10600688 | Methods of producing self-aligned vias | Ying Zhang, Regina Freed, Ho-yung David Hwang, Uday Mitra | 2020-03-24 |
| 10593553 | Germanium etching systems and methods | Mikhail Korolik, Dimitri Kioussis | 2020-03-17 |
| 10593523 | Systems and methods for internal surface conditioning in plasma processing equipment | Soonam Park, Yufei Zhu, Edwin C. Suarez, Dmitry Lubomirsky, Jiayin Huang | 2020-03-17 |
| 10573555 | Methods of producing self-aligned grown via | Ying Zhang, Regina Freed, Ho-yung David Hwang, Uday Mitra, Abhijit Basu Mallick | 2020-02-25 |
| 10573527 | Gas-phase selective etching systems and methods | Geetika Bajaj, Robert Jan Visser, Zihui Li, Prerna Goradia | 2020-02-25 |
| 10566206 | Systems and methods for anisotropic material breakthrough | Mandar B. Pandit | 2020-02-18 |
| 10553485 | Methods of producing fully self-aligned vias and contacts | Ying Zhang, Regina Freed, Ho-yung David Hwang, Uday Mitra, Abhijit Basu Mallick +1 more | 2020-02-04 |
| 10522404 | Fully self-aligned via | Ying Zhang, Abhijit Basu Mallick, Regina Freed, Uday Mitra, Ho-yung David Hwang | 2019-12-31 |
| 10497573 | Selective atomic layer etching of semiconductor materials | Prerna Goradia, Fei Wang, Geetika Bajaj, Zihui Li, Robert Jan Visser +1 more | 2019-12-03 |
| 10497579 | Water-free etching methods | Zhijun Chen, Lin Xu, Anchuan Wang | 2019-12-03 |
| 10490406 | Systems and methods for material breakthrough | Mandar B. Pandit, Mang-Mang Ling, Tom Choi | 2019-11-26 |
| 10490418 | Systems and methods for internal surface conditioning assessment in plasma processing equipment | Soonam Park, Yufei Zhu, Edwin C. Suarez, Dmitry Lubomirsky, Jiayin Huang | 2019-11-26 |