Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148597 | Multi-zone gas distribution systems and methods | Saravjeet Singh, Kenneth D. Schatz, Alan Tso, Marlin Wijekoon | 2024-11-19 |
| 12131913 | Methods, systems, and apparatus for processing substrates using one or more amorphous carbon hardmask layers | Krishna Nittala, Sarah Michelle Bobek, Kwangduk Douglas Lee, Ratsamee Limdulpaiboon, Karthik Janakiraman | 2024-10-29 |
| 11694902 | Methods, systems, and apparatus for processing substrates using one or more amorphous carbon hardmask layers | Krishna Nittala, Sarah Michelle Bobek, Kwangduk Douglas Lee, Ratsamee Limdulpaiboon, Karthik Janakiraman | 2023-07-04 |
| 11581165 | Multi-zone gas distribution systems and methods | Saravjeet Singh, Kenneth D. Schatz, Alan Tso, Marlin Wijekoon | 2023-02-14 |
| 11309404 | Integrated CMOS source drain formation with advanced control | Benjamin Colombeau, Tushar Mandrekar, Patricia M. Liu, Suketu Arun Parikh, Matthias Bauer +2 more | 2022-04-19 |
| 10903054 | Multi-zone gas distribution systems and methods | Saravjeet Singh, Kenneth D. Schatz, Alan Tso, Marlin Wijekoon | 2021-01-26 |
| 10593553 | Germanium etching systems and methods | Mikhail Korolik, Nitin K. Ingle | 2020-03-17 |
| 10177227 | Method for fabricating junctions and spacers for horizontal gate all around devices | Naomi Yoshida, Lin Dong, Shiyu Sun, Myungsun Kim, Nam Sung Kim +3 more | 2019-01-08 |
| 10043674 | Germanium etching systems and methods | Mikhail Korolik, Nitin K. Ingle | 2018-08-07 |
| 9960117 | Air gap semiconductor structure with selective cap bilayer | Stephen M. Gates, Elbert E. Huang, Christopher J. Penny, Deepika Priyadarshini | 2018-05-01 |
| 9711455 | Method of forming an air gap semiconductor structure with selective cap bilayer | Stephen M. Gates, Elbert E. Huang, Christopher J. Penny, Deepika Priyadarshini | 2017-07-18 |
| 9305836 | Air gap semiconductor structure with selective cap bilayer | Stephen M. Gates, Elbert E. Huang, Christopher J. Penny, Deepika Priyadarshini | 2016-04-05 |
| 8183149 | Method of fabricating a conductive interconnect arrangement for a semiconductor device | David Permana, Ravi Prakash Srivastava, Haifeng Sheng | 2012-05-22 |