Issued Patents All Time
Showing 76–100 of 223 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10026597 | Hydrogen plasma based cleaning process for etch hardware | Chirantha Rodrigo, Jingchun Zhang, Lili Ji, Anchuan Wang | 2018-07-17 |
| 9991134 | Processing systems and methods for halide scavenging | Anchuan Wang, Xinglong Chen, Zihui Li, Hiroshi Hamana, Zhijun Chen +5 more | 2018-06-05 |
| 9966240 | Systems and methods for internal surface conditioning assessment in plasma processing equipment | Soonam Park, Yufei Zhu, Edwin C. Suarez, Dmitry Lubomirsky, Jiayin Huang | 2018-05-08 |
| 9960045 | Charge-trap layer separation and word-line isolation for enhanced 3-D NAND structure | Vinod R. Purayath | 2018-05-01 |
| 9947549 | Cobalt-containing material removal | Xikun Wang, Zhenjiang Cui, Soonam Park | 2018-04-17 |
| 9896770 | Methods of etching films with reduced surface roughness | Benjamin Schmiege, Srinivas D. Nemani, Jeffrey W. Anthis, Xikun Wang, Jie Liu +1 more | 2018-02-20 |
| 9887096 | Differential silicon oxide etch | Seung Ho Park, Yunyu Wang, Jingchun Zhang, Anchuan Wang | 2018-02-06 |
| 9875907 | Self-aligned shielding of silicon oxide | Fei Wang, Mikhail Korolik, Anchuan Wang, Robert Jan Visser | 2018-01-23 |
| 9859128 | Self-aligned shielding of silicon oxide | Fei Wang, Mikhail Korolik, Anchuan Wang, Robert Jan Visser | 2018-01-02 |
| 9842744 | Methods for etch of SiN films | Jingchun Zhang, Anchuan Wang | 2017-12-12 |
| 9837284 | Oxide etch selectivity enhancement | Zhijun Chen, Anchuan Wang | 2017-12-05 |
| 9831097 | Methods for selective etching of a silicon material using HF gas without nitrogen etchants | Anchuan Wang, Zihui Li, Mikhail Korolik | 2017-11-28 |
| 9773695 | Integrated bit-line airgap formation and gate stack post clean | Vinod R. Purayath, Randhir P. S. Thakur, Shankar Venkataraman | 2017-09-26 |
| 9754800 | Selective etch for silicon films | Jingchun Zhang, Anchuan Wang | 2017-09-05 |
| 9721789 | Saving ion-damaged spacers | Dongqing Yang, Lala Zhu, Fei Wang | 2017-08-01 |
| 9711366 | Selective etch for metal-containing materials | Jessica S. Kachian, Lin Xu, Soonam Park, Xikun Wang, Jeffrey W. Anthis | 2017-07-18 |
| 9704723 | Processing systems and methods for halide scavenging | Anchuan Wang, Xinglong Chen, Zihui Li, Hiroshi Hamana, Zhijun Chen +5 more | 2017-07-11 |
| 9659792 | Processing systems and methods for halide scavenging | Anchuan Wang, Xinglong Chen, Zihui Li, Hiroshi Hamana, Zhijun Chen +5 more | 2017-05-23 |
| 9659791 | Metal removal with reduced surface roughness | Xikun Wang, David Cui, Anchuan Wang | 2017-05-23 |
| 9653310 | Methods for selective etching of a silicon material | Zihui Li, Xing-Fu Zhong, Anchuan Wang | 2017-05-16 |
| 9613822 | Oxide etch selectivity enhancement | Zhijun Chen, Anchuan Wang | 2017-04-04 |
| 9607856 | Selective titanium nitride removal | Xikun Wang, Anchuan Wang, Dmitry Lubomirsky | 2017-03-28 |
| 9583333 | Low temperature silicon nitride films using remote plasma CVD technology | Amit Chatterjee, Abhijit Basu Mallick | 2017-02-28 |
| 9576815 | Gas-phase silicon nitride selective etch | Jingjing Xu, Fei Wang, Anchuan Wang, Robert Jan Visser | 2017-02-21 |
| 9576809 | Etch suppression with germanium | Mikhail Korolik, Jingchun Zhang, Anchuan Wang, Jie Liu | 2017-02-21 |