Issued Patents All Time
Showing 126–150 of 223 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9378978 | Integrated oxide recess and floating gate fin trimming | Vinod R. Purayath, Randhir P. S. Thakur, Shankar Venkataraman | 2016-06-28 |
| 9378969 | Low temperature gas-phase carbon removal | Ching-Mei Hsu, Hiroshi Hamana, Anchuan Wang | 2016-06-28 |
| 9373522 | Titanium nitride removal | Xikun Wang, Mandar B. Pandit, Anchuan Wang | 2016-06-21 |
| 9362130 | Enhanced etching processes using remote plasma sources | Dmitry Lubomirsky, Xinglong Chen, Shankar Venkataraman | 2016-06-07 |
| 9355922 | Systems and methods for internal surface conditioning in plasma processing equipment | Soonam Park, Yufei Zhu, Edwin C. Suarez, Dmitry Lubomirsky, Jiayin Huang | 2016-05-31 |
| 9355863 | Non-local plasma oxide etch | Zhijun Chen, Seung Ho Park, Mikhail Korolik, Anchuan Wang | 2016-05-31 |
| 9355862 | Fluorine-based hardmask removal | Mandar B. Pandit, Xikun Wang, Zhenjiang Cui, Mikhail Korolik, Anchuan Wang | 2016-05-31 |
| 9355856 | V trench dry etch | Xikun Wang, Anchuan Wang | 2016-05-31 |
| 9343327 | Methods for etch of sin films | Jingchun Zhang, Anchuan Wang | 2016-05-17 |
| 9343293 | Flowable silicon—carbon—oxygen layers for semiconductor processing | Brian Saxton Underwood, Abhijit Basu Mallick | 2016-05-17 |
| 9343272 | Self-aligned process | Mandar B. Pandit, Anchuan Wang | 2016-05-17 |
| 9324576 | Selective etch for silicon films | Jingchun Zhang, Anchuan Wang | 2016-04-26 |
| 9309598 | Oxide and metal removal | Xikun Wang, Jie Liu, Anchuan Wang, Jeffrey W. Anthis, Benjamin Schmiege | 2016-04-12 |
| 9299583 | Aluminum oxide selective etch | Xikun Wang, Anchuan Wang | 2016-03-29 |
| 9299582 | Selective etch for metal-containing materials | Jessica S. Kachian, Lin Xu, Soonam Park, Xikun Wang, Jeffrey W. Anthis | 2016-03-29 |
| 9287134 | Titanium oxide etch | Xikun Wang, Lin Xu, Anchuan Wang | 2016-03-15 |
| 9275834 | Selective titanium nitride etch | Seung Ho Park, Mikhail Korolik, Anchuan Wang | 2016-03-01 |
| 9263278 | Dopant etch selectivity control | Vinod R. Purayath, Anchuan Wang | 2016-02-16 |
| 9236266 | Dry-etch for silicon-and-carbon-containing films | Jingchun Zhang, Anchuan Wang, Yunyu Wang, Young S. Lee | 2016-01-12 |
| 9236265 | Silicon germanium processing | Mikhail Korolik, Anchuan Wang, Jingjing Xu | 2016-01-12 |
| 9209012 | Selective etch of silicon nitride | Zhijun Chen, Zihui Li, Anchuan Wang, Shankar Venkataraman | 2015-12-08 |
| 9202708 | Doped silicon oxide etch | Zhijun Chen, Sang Jin Kim, Anchuan Wang | 2015-12-01 |
| 9190293 | Even tungsten etch for high aspect ratio trenches | Xikun Wang, Jie Liu, Anchuan Wang | 2015-11-17 |
| 9184055 | Processing systems and methods for halide scavenging | Anchuan Wang, Xinglong Chen, Zihui Li, Hiroshi Hamana, Zhijun Chen +5 more | 2015-11-10 |
| 9165786 | Integrated oxide and nitride recess for better channel contact in 3D architectures | Vinod R. Purayath, Randhir P. S. Thakur | 2015-10-20 |