Issued Patents All Time
Showing 51–75 of 89 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6955211 | Method and apparatus for gas temperature control in a semiconductor processing system | Vincent Ku, Dien-Yeh Wu, Alan Ouye, Irena H. Wysok | 2005-10-18 |
| 6953742 | Tantalum barrier layer for copper metallization | Seshadri Ganguli, Wei Cao, Christophe Marcadal | 2005-10-11 |
| 6939801 | Selective deposition of a barrier layer on a dielectric material | Hua Chung, Vincent Ku, Michael Yang, Gongda Yao | 2005-09-06 |
| 6936906 | Integration of barrier layer and seed layer | Hua Chung, Jick Yu, Mei Chang | 2005-08-30 |
| 6916398 | Gas delivery apparatus and method for atomic layer deposition | Vincent Ku, Dien-Yeh Wu, Hua Chung, Alan Ouye, Norman Nakashima | 2005-07-12 |
| 6905541 | Method and apparatus of generating PDMAT precursor | Vincent Ku, Hua Chung, Christophe Marcadal, Seshadri Ganguli, Jenny Lin +3 more | 2005-06-14 |
| 6872429 | Deposition of tungsten nitride using plasma pretreatment in a chemical vapor deposition chamber | Seshadri Ganguli, Alfred Mak | 2005-03-29 |
| 6838125 | Method of film deposition using activated precursor gases | Hua Chung, Vincent Ku | 2005-01-04 |
| 6821891 | Atomic layer deposition of copper using a reducing gas and non-fluorinated copper precursors | Mei Chang | 2004-11-23 |
| 6811814 | Method for growing thin films by catalytic enhancement | Wei Cao | 2004-11-02 |
| 6784096 | Methods and apparatus for forming barrier layers in high aspect ratio vias | Fusen Chen, Walter Glenn, Praburam Gopalraja, Jianming Fu | 2004-08-31 |
| 6772072 | Method and apparatus for monitoring solid precursor delivery | Seshadri Ganguli, Vincent Ku, Hua Chung | 2004-08-03 |
| 6744715 | Method for reducing the frequency of burn | — | 2004-06-01 |
| 6660622 | Process for removing an underlying layer and depositing a barrier layer in one reactor | Seshadri Ganguli, Wei Cao, Christophe Marcadal | 2003-12-09 |
| 6643240 | Method of adjusting the drive speed of a CD drive | — | 2003-11-04 |
| 6620956 | Nitrogen analogs of copper II &bgr;-diketonates as source reagents for semiconductor processing | Barry Chin | 2003-09-16 |
| 6607976 | Copper interconnect barrier layer structure and formation method | Seshadri Ganguli, Christophe Marcadal, Wei Cao, Roderick C. Mosely, Mei Chang | 2003-08-19 |
| 6596085 | Methods and apparatus for improved vaporization of deposition material in a substrate processing system | John V. Schmitt, Shih-Hung Li, Christophe Marcadal, Anzhong Chang | 2003-07-22 |
| 6596643 | CVD TiSiN barrier for copper integration | Christophe Marcadal, Hyungsuk Alexander Yoon | 2003-07-22 |
| 6562715 | Barrier layer structure for copper metallization and method of forming the structure | Christophe Marcadal | 2003-05-13 |
| 6498091 | Method of using a barrier sputter reactor to remove an underlying barrier layer | Seshadri Ganguli, Wei Cao, Christophe Marcadal | 2002-12-24 |
| 6436192 | Apparatus for aligning a wafer | Joseph Yudovsky, Ying Yu, Lawrence Chung-Lai Lei | 2002-08-20 |
| 6410089 | Chemical vapor deposition of copper using profiled distribution of showerhead apertures | Xin Sheng Guo, Keith Kuang-Kuo Koai, Mohan K. Bhan, Bo Zheng | 2002-06-25 |
| 6402806 | Method for unreacted precursor conversion and effluent removal | John V. Schmitt, George Michael Bleyle, Yu D. Cong, Alfred Mak, Mei Chang | 2002-06-11 |
| 6358323 | Method and apparatus for improved control of process and purge material in a substrate processing system | John V. Schmitt, Frank Chang, Xin Guo, Christophe Marcadal | 2002-03-19 |