Issued Patents All Time
Showing 26–50 of 89 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7525892 | Method of erasing an erasable disc | Yi-Shih Wang, Kuo-Chiang Chang | 2009-04-28 |
| 7524374 | Method and apparatus for generating a precursor for a semiconductor processing system | Vincent Ku, Hua Chung, Christophe Marcadal, Seshadri Ganguli, Jenny Lin +3 more | 2009-04-28 |
| 7514358 | Sequential deposition of tantalum nitride using a tantalum-containing precursor and a nitrogen-containing precursor | Wei Cao, Hua Chung, Vincent Ku | 2009-04-07 |
| 7507660 | Deposition processes for tungsten-containing barrier layers | Mei Chang | 2009-03-24 |
| 7494908 | Apparatus for integration of barrier layer and seed layer | Hua Chung, Jick Yu, Mei Chang | 2009-02-24 |
| 7429361 | Method and apparatus for providing precursor gas to a processing chamber | Seshadri Ganguli, Vincent Ku | 2008-09-30 |
| 7422637 | Processing chamber configured for uniform gas flow | Vincent Ku, Howard Grunes, Hua Chung | 2008-09-09 |
| 7406090 | Managing a buffer for media processing | — | 2008-07-29 |
| 7404985 | Noble metal layer formation for copper film deposition | Mei Chang | 2008-07-29 |
| 7402210 | Apparatus and method for hybrid chemical processing | Vincent Ku, Mei Chang, Dien-Yeh Wu, Hua Chung | 2008-07-22 |
| 7352048 | Integration of barrier layer and seed layer | Hua Chung, Jick Yu, Mei Chang | 2008-04-01 |
| 7270709 | Method and apparatus of generating PDMAT precursor | Vincent Ku, Hua Chung, Christophe Marcadal, Seshadri Ganguli, Jenny Lin +3 more | 2007-09-18 |
| 7262133 | Enhancement of copper line reliability using thin ALD tan film to cap the copper line | Mei Chang | 2007-08-28 |
| 7244683 | Integration of ALD/CVD barriers with porous low k materials | Hua Chung, Nikolaos Bekiaris, Christophe Marcadal | 2007-07-17 |
| 7228873 | Valve design and configuration for fast delivery system | Vincent Ku, Dien-Yeh Wu | 2007-06-12 |
| 7204886 | Apparatus and method for hybrid chemical processing | Vincent Ku, Mei Chang, Dien-Yeh Wu, Hua Chung | 2007-04-17 |
| 7200083 | Speed control method for recording data on an optical disk | — | 2007-04-03 |
| 7186385 | Apparatus for providing gas to a processing chamber | Seshadri Ganguli, Vincent Ku | 2007-03-06 |
| 7081271 | Cyclical deposition of refractory metal silicon nitride | Hua Chung, Barry Chin | 2006-07-25 |
| 7076579 | Structure and method for multi-section management of a buffer | — | 2006-07-11 |
| 7066194 | Valve design and configuration for fast delivery system | Vincent Ku, Dien-Yeh Wu | 2006-06-27 |
| 7026238 | Reliability barrier integration for Cu application | Ming Xi, Paul Smith, Michael Yang, Mei Chang, Fusen Chen +2 more | 2006-04-11 |
| 6974771 | Methods and apparatus for forming barrier layers in high aspect ratio vias | Fusen Chen, Walter Glenn, Praburam Gopalraja, Jianming Fu | 2005-12-13 |
| 6972267 | Sequential deposition of tantalum nitride using a tantalum-containing precursor and a nitrogen-containing precursor | Wei Cao, Hua Chung, Vincent Ku | 2005-12-06 |
| 6958296 | CVD TiSiN barrier for copper integration | Christophe Marcadal, Hyungsuk Alexander Yoon | 2005-10-25 |