Issued Patents All Time
Showing 76–100 of 127 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6352817 | Methodology for mitigating formation of t-tops in photoresist | Bharath Rangarajan, Bhanwar Singh | 2002-03-05 |
| 6350687 | Method of fabricating improved copper metallization including forming and removing passivation layer before forming capping film | Kai Yang, Sergey Lopatin, Todd P. Lukanc | 2002-02-26 |
| 6346466 | Planarization of a polysilicon layer surface by chemical mechanical polish to improve lithography and silicide formation | Steven K. Park | 2002-02-12 |
| 6332989 | Slurry for chemical mechanical polishing of copper | Kai Yang, Christy Mei-Chu Woo | 2001-12-25 |
| 6326305 | Ceria removal in chemical-mechanical polishing of integrated circuits | Diana M. Shonauer | 2001-12-04 |
| 6319834 | Method and apparatus for improved planarity metallization by electroplating and CMP | Darrell M. Erb, Fei Wang | 2001-11-20 |
| 6319833 | Chemically preventing copper dendrite formation and growth by spraying | Diana M. Schonauer, Kai Yang | 2001-11-20 |
| 6291339 | Bilayer interlayer dielectric having a substantially uniform composite interlayer dielectric constant over pattern features of varying density and method of making the same | Simon S. Chan | 2001-09-18 |
| 6268285 | Method of removing plasma etch damage to pre-silicidized surfaces by wet silicon etch | Susan H. Chen | 2001-07-31 |
| 6265273 | Method of forming rectangular shaped spacers | Stephen Keetai Park, Bharath Rangarajan, Jeffrey A. Shields, Larry Wang, Guarionex Morales | 2001-07-24 |
| 6235453 | Low-k photoresist removal process | Lu You, Jacques Bertrand, Richard J. Huang | 2001-05-22 |
| 6232635 | Method to fabricate a high coupling flash cell with less silicide seam problem | Larry Wang, Jeffrey A. Shields, Stephen Keetai Park | 2001-05-15 |
| 6218290 | Copper dendrite prevention by chemical removal of dielectric | Diana M. Schonauer, Kai Yang | 2001-04-17 |
| 6211071 | Optimized trench/via profile for damascene filling | Todd P. Lukanc, Fei Wang | 2001-04-03 |
| 6207569 | Prevention of Cu dendrite formation and growth | Diana M. Schonauer, Kai Yang | 2001-03-27 |
| 6197690 | Chemically preventing Cu dendrite formation and growth by double sided scrubbing | Diana M. Schonauer, Kai Yang | 2001-03-06 |
| 6184141 | Method for multiple phase polishing of a conductive layer in a semidonductor wafer | Kashmir Sahota, Gerd Marxsen | 2001-02-06 |
| 6177349 | Preventing Cu dendrite formation and growth | Diana M. Schonauer, Kai Yang | 2001-01-23 |
| 6169034 | Chemically removable Cu CMP slurry abrasive | Darrell M. Erb, Diana M. Schonauer, Kai Yang | 2001-01-02 |
| 6162727 | Chemical treatment for preventing copper dendrite formation and growth | Diana M. Schonauer, Kai Yang | 2000-12-19 |
| 6153933 | Elimination of residual materials in a multiple-layer interconnect structure | Darin A. Chan, Subramanian Venkatkrishnan, Minh Van Ngo, Christy Mei-Chu Woo de la Girond'arc, Diana M. Schonauer | 2000-11-28 |
| 6143656 | Slurry for chemical mechanical polishing of copper | Kai Yang, Christy Mei-Chu Woo | 2000-11-07 |
| 6140239 | Chemically removable Cu CMP slurry abrasive | Darrell M. Erb, Diana M. Schonauer, Kai Yang | 2000-10-31 |
| 6137126 | Method to reduce gate-to-local interconnect capacitance using a low dielectric constant material for LDD spacer | Minh Van Ngo, Angela T. Hui, Chun Jiang, Hamid Partovi | 2000-10-24 |
| 6121149 | Optimized trench/via profile for damascene filling | Todd P. Lukanc, Fei Wang | 2000-09-19 |