Issued Patents 2022
Showing 26–44 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355428 | Semiconductor package | Jiun Yi Wu, Chen-Hua Yu | 2022-06-07 |
| 11355378 | Fan-out interconnect structure and methods forming the same | Yu-Hsiang Hu, Hung-Jui Kuo, Ming-Da Cheng | 2022-06-07 |
| 11342295 | Electronic assembly, package structure having hollow cylinders and method of fabricating the same | Chen-Hua Yu, Hao-Yi Tsai, Tin-Hao Kuo | 2022-05-24 |
| 11322360 | Method of manufacturing semiconductor structure | Yu-Hsiang Hu, Wei-Yu Chen, Hung-Jui Kuo, Wei-Hung Lin, Ming-Da Cheng | 2022-05-03 |
| 11282761 | Semiconductor packages and methods of manufacturing the same | Jiun Yi Wu, Chen-Hua Yu, Yu-Min Liang | 2022-03-22 |
| 11282785 | Wireless charging package with chip integrated in coil center | Chen-Hua Yu, Chiang-Jui Chu, Hao-Yi Tsai, Ming Hung Tseng, Hung-Yi Kuo | 2022-03-22 |
| 11270921 | Semiconductor package including dies having high-modulus dielectric layer and manufacturing method thereof | Hao-Cheng Hou, Chien-Hsun Lee, Jung Wei Cheng, Tsung-Ding Wang, Yi-Yang Lei | 2022-03-08 |
| 11264342 | Package on package structure and method for forming the same | Chen-Hua Yu, Ming-Da Cheng, Mirng-Ji Lii, Meng-Tse Chen, Wei-Hung Lin | 2022-03-01 |
| 11257714 | Method of making a pillar structure having a non-metal sidewall protection structure and integrated circuit including the same | Chien Ling Hwang, Yi-Wen Wu, Chun-Chieh Wang | 2022-02-22 |
| 11251099 | Warpage control of packages using embedded core frame | Jiun Yi Wu, Chen-Hua Yu | 2022-02-15 |
| 11251141 | Package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin +4 more | 2022-02-15 |
| 11245176 | Package structure, electronic device and method of fabricating package structure | Min-Chien Hsiao, Chen-Hua Yu, Chao-Wen Shih, Shou-Zen Chang | 2022-02-08 |
| 11239103 | Package-on-package structure | Chih-Wei Lin, Hui-Min Huang, Ai-Tee Ang, Yu-Peng Tsai, Ming-Da Cheng | 2022-02-01 |
| 11239201 | 3D integrated circuit (3DIC) structure | Chen-Hua Yu, Wen-Chih Chiou | 2022-02-01 |
| 11239193 | Integrated circuit package and method | Chien-Hsun Chen, Shou-Yi Wang, Jiun Yi Wu, Chen-Hua Yu | 2022-02-01 |
| 11233032 | Mechanisms for forming bonding structures | Yeong-Jyh Lin, Hsin-Hung Liao, Chien Ling Hwang, Bor-Ping Jang, Hsiao-Chung Liang | 2022-01-25 |
| 11217538 | Integrated circuit package and method | Jiun Yi Wu, Chien-Hsun Lee | 2022-01-04 |
| 11217555 | Aligning bumps in fan-out packaging process | Ying-Jui Huang, Chien Ling Hwang, Chih-Wei Lin, Ching-Hua Hsieh, Chen-Hua Yu | 2022-01-04 |
| 11217497 | Integrated circuit package and method | Chien-Hsun Chen, Yu-Ling Tsai, Jiun Yi Wu, Chien-Hsun Lee | 2022-01-04 |