Issued Patents 2018
Showing 26–41 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9984981 | Packages with interposers and methods for forming the same | Sao-Ling Chiu, Kuo-Ching Hsu, Wei-Cheng Wu, Ping-Kang Huang, Shang-Yun Hou +1 more | 2018-05-29 |
| 9978637 | Mechanism for forming patterned metal pad connected to multiple through silicon vias (TSVs) | Tzuan-Horng Liu, Shih-Wen Huang, Chung-Yu Lu, Hsien-Pin Hu, Shang-Yun Hou | 2018-05-22 |
| 9978660 | Package with embedded heat dissipation features | Wensen Hung, Szu-Po Huang, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu | 2018-05-22 |
| 9960134 | Semiconductor device and bump formation process | Yi-Li Hsiao, Chen-Hua Yu, Chih-Hang Tung, Cheng-Chang Wei | 2018-05-01 |
| 9960088 | End point detection in grinding | Yi-Chao Mao, Jui-Pin Hung, Jing-Cheng Lin, Chen-Hua Yu | 2018-05-01 |
| 9950450 | Molding chamber apparatus and curing method | Jing-Cheng Lin, Chen-Hua Yu, Jui-Pin Hung, Hsien-Wen Liu | 2018-04-24 |
| 9953948 | Pillar design for conductive bump | Cheng-Chieh Hsieh, Cheng-Lin Huang, Po-Hao Tsai, Shang-Yun Hou, Jing-Cheng Lin | 2018-04-24 |
| 9941251 | 3DIC packages with heat dissipation structures | Wensen Hung, Szu-Po Huang, Kim Hong Chen | 2018-04-10 |
| 9935080 | Three-layer Package-on-Package structure and method forming same | Jui-Pin Hung, Feng-Cheng Hsu | 2018-04-03 |
| 9929126 | Packages with metal line crack prevention design | Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Jie Chen | 2018-03-27 |
| 9922943 | Chip-on-substrate packaging on carrier | Chen-Hua Yu, Tzu-Shiun Sheu, Shih-Peng Tai, An-Jhih Su, Chi-Hsi Wu | 2018-03-20 |
| 9911629 | Integrated passive device package and methods of forming same | Feng-Cheng Hsu, Shuo-Mao Chen, Jui-Pin Hung | 2018-03-06 |
| 9899467 | Semiconductor devices, methods of manufacture thereof, and capacitors | Wen-Chih Chiou, Ebin Liao | 2018-02-20 |
| 9881908 | Integrated fan-out package on package structure and methods of forming same | Wen-Yi Lin, Hsien-Wen Liu, Po-Yao Lin, Cheng-Lin Huang, Shyue-Ter Leu | 2018-01-30 |
| 9870975 | Chip package with thermal dissipation structure and method for forming the same | Chin-Hua Wang, Po-Yao Lin, Shu-Shen Yeh, Kuang-Chun Lee, Shyue-Ter Leu +2 more | 2018-01-16 |
| 9859235 | Underbump metallization structure | Yu-Wen Liu, Hao-Yi Tsai, Hsien-Wei Chen, Ying-Ju Chen, Shang-Yun Hou +2 more | 2018-01-02 |