Issued Patents All Time
Showing 326–350 of 355 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7888236 | Semiconductor device and fabrication methods thereof | Han-Ping Pu, Bai-Yao Lou, Dean Wang, Ching-Wen Hsiao, Kai-Ming Ching +3 more | 2011-02-15 |
| 7883991 | Temporary carrier bonding and detaching processes | Wen-Jin Wu, Shau-Lin Shue | 2011-02-08 |
| 7879711 | Stacked structures and methods of fabricating stacked structures | Chen-Hua Yu, Weng-Jin Wu, Jean Wang | 2011-02-01 |
| 7875534 | Realizing N-face III-nitride semiconductors by nitridation treatment | Chen-Hua Yu, Chia-Lin Yu, Ding-Yuan Chen | 2011-01-25 |
| 7872357 | Protection for bonding pads and methods of formation | Chen-Hua Yu, Weng-Jin Wu | 2011-01-18 |
| RE41935 | Method for preventing low-k dielectric layer cracking in multi-layered dual damascene metallization layers | Shing-Chyang Pan, Keng-Chu Lin, Shwang-Ming Jeng | 2010-11-16 |
| 7812459 | Three-dimensional integrated circuits with protection layers | Chen-Hua Yu, Weng-Jin Wu, Hung-Jung Tu, Ku-Feng Yang | 2010-10-12 |
| 7466028 | Semiconductor contact structure | Chen-Hua Yu, Hung-Jung Tu, Weng-Jin Wu | 2008-12-16 |
| 7416648 | Image sensor system for monitoring condition of electrode for electrochemical process tools | Ying-Ho Chen, Cheng-Hsun Chan | 2008-08-26 |
| 7385283 | Three dimensional integrated circuit and method of making the same | Weng-Jin Wu | 2008-06-10 |
| 7371662 | Method for forming a 3D interconnect and resulting structures | — | 2008-05-13 |
| 7232362 | Chemical mechanical polishing process for manufacturing semiconductor devices | Ying-Ho Chen, Chen-Hua Yu | 2007-06-19 |
| 7220677 | WAT process to avoid wiring defects | Lin Li, Yung-Cheng Lu, Chih-Hsien Lin | 2007-05-22 |
| 7208331 | Methods and structures for critical dimension and profile measurement | Jyu-Horng Shieh, Peng-Fu Hsu, Baw-Ching Perng, Hun-Jan Tao, Chia-Jen Chen | 2007-04-24 |
| 7105446 | Apparatus for pre-conditioning CMP polishing pad | Chia-Che Chuang, Hsin-Hsien Lu, Liang-Guang Chen | 2006-09-12 |
| 7091126 | Method for copper surface smoothing | Han-Hsin Kuo, Hung-Wen Su, Tsu Shih, Hsien-Ming Lee | 2006-08-15 |
| 6946397 | Chemical mechanical polishing process with reduced defects in a copper process | William Weilun Hong, Chia-Che CHUNG, Chi-Wei Chung, Ying-Ho Chen, Syun-Ming Jang | 2005-09-20 |
| 6849549 | Method for forming dummy structures for improved CMP and reduced capacitance | Syun-Ming Jang | 2005-02-01 |
| 6846756 | Method for preventing low-k dielectric layer cracking in multi-layered dual damascene metallization layers | Shing-Chyang Pan, Keng-Chu Lin, Shwang-Ming Jeng | 2005-01-25 |
| 6736701 | Eliminate broken line damage of copper after CMP | Shau-Lin Shue, Ying-Ho Chen, Tsu Shih, Syun-Ming Jang | 2004-05-18 |
| 6727172 | Process to reduce chemical mechanical polishing damage of narrow copper lines | Shwangming Jong, Syun-Ming Jang | 2004-04-27 |
| 6635211 | Reinforced polishing pad for linear chemical mechanical polishing and method for forming | Ying-Ho Chen, Tsu Shih, Syun-Ming Jang | 2003-10-21 |
| 6634930 | Method and apparatus for preventing metal corrosion during chemical mechanical polishing | Ying-Ho Chen, Tsu Shih, Syun-Ming Jang, Chia-Ming Yang | 2003-10-21 |
| 6544891 | Method to eliminate post-CMP copper flake defect | Ying-Ho Chen, Tsu Shih, Syun-Ming Jang | 2003-04-08 |
| 6515366 | Reduction of metal corrosion in semiconductor devices | Tsu Shih | 2003-02-04 |