Issued Patents All Time
Showing 301–325 of 355 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8236583 | Method of separating light-emitting diode from a growth substrate | Ding-Yuan Chen, Hung-Ta Lin, Chen-Hua Yu | 2012-08-07 |
| 8232140 | Method for ultra thin wafer handling and processing | Ku-Feng Yang, Weng-Jin Wu, Tsung-Ding Wang | 2012-07-31 |
| 8154038 | Group-III nitride for reducing stress caused by metal nitride reflector | Chen-Hua Yu, Ding-Yuan Chen, Chia-Lin Yu | 2012-04-10 |
| 8148732 | Carbon-containing semiconductor substrate | Chen-Hua Yu, Chia-Lin Yu, Ding-Yuan Chen, Hung-Ta Lin | 2012-04-03 |
| 8148826 | Three-dimensional integrated circuits with protection layers | Chen-Hua Yu, Weng-Jin Wu, Hung-Jung Tu, Ku-Feng Yang | 2012-04-03 |
| 8134163 | Light-emitting diodes on concave texture substrate | Chen-Hua Yu, Hung-Ta Lin, Ding-Yuan Chen, Chia-Lin Yu | 2012-03-13 |
| 8134235 | Three-dimensional semiconductor device | David Lu | 2012-03-13 |
| 8119500 | Wafer bonding | Ku-Feng Yang, Weng-Jin Wu, Chen-Hua Yu | 2012-02-21 |
| 8105875 | Approach for bonding dies onto interposers | Hsien-Pin Hu, Chen-Hua Yu, Shin-Puu Jeng, Shang-Yun Hou, Jing-Cheng Lin +1 more | 2012-01-31 |
| 8058082 | Light-emitting diode with textured substrate | Chen-Hua Yu, Ding-Yuan Chen, Chia-Lin Yu, Hung-Ta Lin | 2011-11-15 |
| 8058150 | Particle free wafer separation | Weng-Jin Wu, Ku-Feng Yang, Jung-Chih Hu, Chen-Hua Yu | 2011-11-15 |
| 8058669 | Light-emitting diode integration scheme | Ding-Yuan Chen, Chen-Hua Yu | 2011-11-15 |
| 8053900 | Through-substrate vias (TSVs) electrically connected to a bond pad design with reduced dishing effect | Chen-Hua Yu, Weng-Jin Wu | 2011-11-08 |
| 8053277 | Three-dimensional integrated circuits with protection layers | Chen-Hua Yu, Weng-Jin Wu, Hung-Jung Tu, Ku-Feng Yang | 2011-11-08 |
| 8044409 | III-nitride based semiconductor structure with multiple conductive tunneling layer | Chia-Lin Yu, Ding-Yuan Chen, Chen-Hua Yu | 2011-10-25 |
| 8021566 | Method for pre-conditioning CMP polishing pad | Chia-Che Chuang, Hsin-Hsien Lu, Liang-Guang Chen | 2011-09-20 |
| 7989318 | Method for stacking semiconductor dies | Ku-Feng Yang, Weng-Jin Wu, Chen-Hua Yu | 2011-08-02 |
| 7972969 | Method and apparatus for thinning a substrate | Ku-Feng Yang, Weng-Jin Wu, Kewei Zuo | 2011-07-05 |
| 7960290 | Method of fabricating a semiconductor device | Chen-Hua Yu, Weng-Jin Wu | 2011-06-14 |
| 7955895 | Structure and method for stacked wafer fabrication | Ku-Feng Yang, Weng-Jin Wu, Hung-Jung Tu | 2011-06-07 |
| 7956448 | Stacked structures and methods of fabricating stacked structures | Chen-Hua Yu, Weng-Jin Wu, Jean Wang | 2011-06-07 |
| 7951647 | Performing die-to-wafer stacking by filling gaps between dies | Ku-Feng Yang, Weng-Jin Wu, Ming-Chung Sung | 2011-05-31 |
| 7943421 | Component stacking using pre-formed adhesive films | Weng-Jin Wu, Hung-Jung Tu, Ku-Feng Yang, Jung-Chih Hu | 2011-05-17 |
| 7939941 | Formation of through via before contact processing | Chen-Hua Yu, Weng-Jin Wu | 2011-05-10 |
| 7897481 | High throughput die-to-wafer bonding using pre-alignment | Weng-Jin Wu, Chen-Hua Yu | 2011-03-01 |