Issued Patents All Time
Showing 251–275 of 355 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8691706 | Reducing substrate warpage in semiconductor processing | Chen-Hua Yu, Fang Wen Tsai, Kuang-Wei Cheng, Jiann Sheng Chang, Yi Chou Lai +1 more | 2014-04-08 |
| 8691664 | Backside process for a substrate | Ku-Feng Yang, Weng-Jin Wu, Jung-Chih Hu | 2014-04-08 |
| 8686474 | III-V compound semiconductor epitaxy from a non-III-V substrate | Ding-Yuan Chen, Chia-Lin Yu, Chen-Hua Yu | 2014-04-01 |
| 8680682 | Barrier for through-silicon via | Chen-Hua Yu, Weng-Jin Wu | 2014-03-25 |
| 8674513 | Interconnect structures for substrate | Chen-Hua Yu, Shin-Puu Jeng, Tsang-Jiuh Wu | 2014-03-18 |
| 8673775 | Methods of forming semiconductor structures | Tsang-Jiuh Wu, Ku-Feng Yang, Hsin-Yu Chen | 2014-03-18 |
| 8669174 | Multi-die stacking using bumps with different sizes | Weng-Jin Wu, Ying-Ching Shih, Shin-Puu Jeng, Chen-Hua Yu | 2014-03-11 |
| 8664749 | Component stacking using pre-formed adhesive films | Weng-Jin Wu, Hung-Jung Tu, Ku-Feng Yang, Jung-Chih Hu | 2014-03-04 |
| 8659033 | Light-emitting diode with textured substrate | Chen-Hua Yu, Ding-Yuan Chen, Chia-Lin Yu, Hung-Ta Lin | 2014-02-25 |
| 8647925 | Surface modification for handling wafer thinning process | Shau-Lin Shue, Weng-Jin Wu, Ju-Pin Hung | 2014-02-11 |
| 8629042 | Method for stacking semiconductor dies | Ku-Feng Yang, Weng-Jin Wu, Chen-Hua Yu | 2014-01-14 |
| 8629066 | Liner formation in 3DIC structures | Ching-Yu Lo, Hung-Jung Tu, Hai-Ching Chen, Tien-I Bao, Chen-Hua Yu | 2014-01-14 |
| 8629465 | Light-emitting diodes on concave texture substrate | Chen-Hua Yu, Hung-Ta Lin, Ding-Yuan Chen, Chia-Lin Yu | 2014-01-14 |
| 8629565 | Thin wafer protection device | Ku-Feng Yang, Weng-Jin Wu, Tsung-Ding Wang | 2014-01-14 |
| 8629568 | Semiconductor device cover mark | Yan-Fu Lin, Jing-Cheng Lin, Shin-Puu Jeng, Chen-Hua Yu | 2014-01-14 |
| 8609448 | Omnidirectional reflector | Ding-Yuan Chen, Chen-Hua Yu | 2013-12-17 |
| 8587127 | Semiconductor structures and methods of forming the same | Tsang-Jiuh Wu, Ku-Feng Yang, Hsin-Yu Chen | 2013-11-19 |
| 8581418 | Multi-die stacking using bumps with different sizes | Weng-Jin Wu, Ying-Ching Shih, Shin-Puu Jeng, Chen-Hua Yu | 2013-11-12 |
| 8580682 | Cost-effective TSV formation | Ku-Feng Yang, Yung-Chi Lin, Hung-Pin Chang, Tsang-Jiuh Wu | 2013-11-12 |
| 8575725 | Through-silicon vias for semicondcutor substrate and method of manufacture | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang +4 more | 2013-11-05 |
| 8567837 | Reconfigurable guide pin design for centering wafers having different sizes | Hsin Chang, Hsin-Yu Chen, Fang Wen Tsai, Jing-Cheng Lin, Shin-Puu Jeng +1 more | 2013-10-29 |
| 8540506 | Semiconductor molding chamber | Jing-Cheng Lin, Shin-Puu Jeng, Chen-Hua Yu | 2013-09-24 |
| 8531035 | Interconnect barrier structure and method | Chen-Hua Yu, Tsang-Jiuh Wu | 2013-09-10 |
| 8528802 | Apparatus and method of substrate to substrate bonding for three dimensional (3D) IC interconnects | Chen-Hua Yu, Weng-Jin Wu | 2013-09-10 |
| 8525200 | Light-emitting diode with non-metallic reflector | Ding-Yuan Chen, Chen-Hua Yu | 2013-09-03 |