Issued Patents All Time
Showing 226–250 of 355 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8853830 | System, structure, and method of manufacturing a semiconductor substrate stack | Hung-Pin Chang, Weng-Jin Wu, Chen-Hua Yu | 2014-10-07 |
| 8846499 | Composite carrier structure | Ying-Ching Shih, Weng-Jin Wu, Jing-Cheng Lin, Shin-Puu Jeng, Chen-Hua Yu | 2014-09-30 |
| 8847388 | Bump with protection structure | Chen-Hua Yu, Hung-Pin Chang, An-Jhih Su, Tsang-Jiuh Wu, Shin-Puu Jeng | 2014-09-30 |
| 8846523 | Process of forming through-silicon via structure | Weng-Jin Wu, Yung-Chi Lin | 2014-09-30 |
| 8836085 | Cost-effective TSV formation | Ku-Feng Yang, Yung-Chi Lin, Hung-Pin Chang, Tsang-Jiuh Wu | 2014-09-16 |
| 8835313 | Interconnect barrier structure and method | Chen-Hua Yu, Tsang-Jiuh Wu | 2014-09-16 |
| 8823049 | Light-emitting diode with current-spreading region | Ding-Yuan Chen, Chen-Hua Yu | 2014-09-02 |
| 8815618 | Light-emitting diode on a conductive substrate | Ding-Yuan Chen, Chen-Hua Yu | 2014-08-26 |
| 8803322 | Through substrate via structures and methods of forming the same | Ku-Feng Yang, Tsang-Jiuh Wu, Yi-Hsiu Chen, Ebin Liao, Yuan-Hung Liu | 2014-08-12 |
| 8802504 | 3D packages and methods for forming the same | Shang-Yun Hou, Sao-Ling Chiu, Ping-Kang Huang, Wen-Hsin Wei, Shin-Puu Jeng +1 more | 2014-08-12 |
| 8803189 | III-V compound semiconductor epitaxy using lateral overgrowth | Chen-Hua Yu, Chia-Lin Yu, Ding-Yuan Chen, Hung-Ta Lin | 2014-08-12 |
| 8803316 | TSV structures and methods for forming the same | Yung-Chi Lin, Hsin-Yu Chen, Ku-Feng Yang, Tsang-Jiuh Wu, Jing-Cheng Lin | 2014-08-12 |
| 8791549 | Wafer backside interconnect structure connected to TSVs | Ming-Fa Chen, Shau-Lin Shue | 2014-07-29 |
| 8779445 | Stress-alleviation layer for LED structures | Chen-Hua Yu, Hung-Ta Lin, Ding-Yuan Chen, Chia-Lin Yu | 2014-07-15 |
| 8772945 | Through silicon via with embedded barrier pad | Yung-Chi Lin, Yen-Hung Chen, Sylvia Lo, Jing-Cheng Lin | 2014-07-08 |
| 8765549 | Capacitor for interposers and methods of manufacture thereof | Chun Hua Chang, Shin-Puu Jeng, Der-Chyang Yeh, Shang-Yun Hou | 2014-07-01 |
| 8766309 | Omnidirectional reflector | Ding-Yuan Chen, Chen-Hua Yu | 2014-07-01 |
| 8759150 | Approach for bonding dies onto interposers | Hsien-Pin Hu, Chen-Hua Yu, Shin-Puu Jeng, Shang-Yun Hou, Jing-Cheng Lin +1 more | 2014-06-24 |
| 8749027 | Robust TSV structure | Hsien-Wei Chen, Shin-Puu Jeng, Hung-Jung Tu | 2014-06-10 |
| 8742441 | Light-emitting diode with embedded elements | Ding-Yuan Chen, Chen-Hua Yu | 2014-06-03 |
| 8736039 | Stacked structures and methods of forming stacked structures | Weng-Jin Wu, Chen-Hua Yu | 2014-05-27 |
| 8716867 | Forming interconnect structures using pre-ink-printed sheets | Francis Ko, Chi-Chun Hsieh, Shang-Yun Hou, Shin-Puu Jeng, Chen-Hua Yu | 2014-05-06 |
| 8716723 | Reflective layer between light-emitting diodes | Ding-Yuan Chen, Chia-Lin Yu, Chen-Hua Yu | 2014-05-06 |
| 8704375 | Barrier structures and methods for through substrate vias | Max Liu, Chao-Shun Hsu, Ya-Wen Tseng, Weng-Jin Wu | 2014-04-22 |
| 8693163 | Cylindrical embedded capacitors | An-Jhih Su, Chi-Chun Hsieh, Tzu-Yu Wang, Wei-Cheng Wu, Hsien-Pin Hu +2 more | 2014-04-08 |