Issued Patents All Time
Showing 276–300 of 355 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8525343 | Device with through-silicon via (TSV) and method of forming the same | Chen-Hua Yu, Ebin Liao, Tsang-Jiuh Wu | 2013-09-03 |
| 8525216 | Light-emitting diode integration scheme | Ding-Yuan Chen, Chen-Hua Yu | 2013-09-03 |
| 8519414 | III-nitride based semiconductor structure with multiple conductive tunneling layer | Chia-Lin Yu, Ding-Yuan Chen, Chen-Hua Yu | 2013-08-27 |
| 8513119 | Method of forming bump structure having tapered sidewalls for stacked dies | Hung-Pin Chang, Kuo-Ching Hsu, Chen-Shien Chen, Chen-Hua Yu | 2013-08-20 |
| 8500182 | Vacuum wafer carriers for strengthening thin wafers | Ku-Feng Yang, Weng-Jin Wu, Jing-Cheng Lin, Chen-Hua Yu | 2013-08-06 |
| 8486807 | Realizing N-face III-nitride semiconductors by nitridation treatment | Chen-Hua Yu, Chia-Lin Yu, Ding-Yuan Chen | 2013-07-16 |
| 8486730 | Method of separating light-emitting diode from a growth substrate | Ding-Yuan Chen, Hung-Ta Lin, Chen-Hua Yu | 2013-07-16 |
| 8487410 | Through-silicon vias for semicondcutor substrate and method of manufacture | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang +4 more | 2013-07-16 |
| 8486823 | Methods of forming through via | Chen-Hua Yu, Weng-Jin Wu, Jung-Chih Hu | 2013-07-16 |
| 8441136 | Protection layer for adhesive material at wafer edge | Weng-Jin Wu, Shau-Lin Shue | 2013-05-14 |
| 8432038 | Through-silicon via structure and a process for forming the same | Weng-Jin Wu, Yung-Chi Lin | 2013-04-30 |
| 8426961 | Embedded 3D interposer structure | Ying-Ching Shih, Jing-Cheng Lin, Shin-Puu Jeng, Chen-Hua Yu | 2013-04-23 |
| 8415691 | Omnidirectional reflector | Ding-Yuan Chen, Chen-Hua Yu | 2013-04-09 |
| 8405225 | Three-dimensional integrated circuits with protection layers | Chen-Hua Yu, Weng-Jin Wu, Hung-Jung Tu, Ku-Feng Yang | 2013-03-26 |
| 8399273 | Light-emitting diode with current-spreading region | Ding-Yuan Chen, Chen-Hua Yu | 2013-03-19 |
| 8387674 | Chip on wafer bonder | Chen-Hua Yu, Jui-Pin Hung, Weng-Jin Wu, Jean Wang | 2013-03-05 |
| 8377796 | III-V compound semiconductor epitaxy from a non-III-V substrate | Chia-Lin Yu, Chen-Hua Yu, Ding-Yuan Chen | 2013-02-19 |
| 8362593 | Method for stacking semiconductor dies | Ku-Feng Yang, Weng-Jin Wu, Chen-Hua Yu | 2013-01-29 |
| 8344513 | Barrier for through-silicon via | Chen-Hua Yu, Weng-Jin Wu | 2013-01-01 |
| 8329578 | Via structure and via etching process of forming the same | Hung-Pin Chang, Chen-Hua Yu | 2012-12-11 |
| 8319349 | Approach for bonding dies onto interposers | Hsien-Pin Hu, Chen-Hua Yu, Shin-Puu Jeng, Shang-Yun Hou, Jing-Cheng Lin +1 more | 2012-11-27 |
| 8278679 | LED device with embedded top electrode | Chen-Hua Yu, Ding-Yuan Chen | 2012-10-02 |
| 8264077 | Backside metal of redistribution line with silicide layer on through-silicon via of semiconductor chips | Weng-Jin Wu | 2012-09-11 |
| 8264066 | Liner formation in 3DIC structures | Ching-Yu Lo, Hung-Jung Tu, Hai-Ching Chen, Tien-I Bao, Chen-Hua Yu | 2012-09-11 |
| 8252665 | Protection layer for adhesive material at wafer edge | Weng-Jin Wu, Shau-Lin Shue | 2012-08-28 |