Issued Patents All Time
Showing 301–325 of 393 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9691840 | Cylindrical embedded capacitors | An-Jhih Su, Chi-Chun Hsieh, Tzu-Yu Wang, Hsien-Pin Hu, Shang-Yun Hou +2 more | 2017-06-27 |
| 9691686 | Contact pad for semiconductor device | Chang-Chia Huang, Tsung-Shu Lin, Cheng-Chieh Hsieh | 2017-06-27 |
| 9685223 | Voltage controller | Wei Min Chan, Yen-Huei Chen, Hung-Jen Liao | 2017-06-20 |
| 9679979 | Semiconductor structure for flash memory cells and method of making same | Ming Chyi Liu, Chang-Ming Wu, Shih-Chang Liu, Harry-Hak-Lay Chuang, Chia-Shiung Tsai +1 more | 2017-06-13 |
| 9673194 | Semiconductor arrangement and formation thereof | Harry-Hak-Lay Chuang, Shih-Chang Liu, Ming Chyi Liu | 2017-06-06 |
| 9673205 | Embedded nonvolatile memory and forming method thereof | Chang-Ming Wu, Yuan-Tai Tseng, Shih-Chang Liu, Chia-Shiung Tsai, Ru-Liang Lee +1 more | 2017-06-06 |
| 9659953 | HKMG high voltage CMOS for embedded non-volatile memory | Harry-Hak-Lay Chuang, Ya-Chen Kao, Yi Hsien Lu | 2017-05-23 |
| 9659620 | Memory device with self-boosted mechanism | Yen-Huei Chen, Hung-Jen Liao, Chih-Yu Lin, Jonathan Tsung-Yung Chang | 2017-05-23 |
| 9633869 | Packages with interposers and methods for forming the same | Sao-Ling Chiu, Kuo-Ching Hsu, Ping-Kang Huang, Shang-Yun Hou, Shin-Puu Jeng +1 more | 2017-04-25 |
| 9620372 | HK embodied flash memory and methods of forming the same | Ming Chyi Liu, Wei-Hang Huang, Yu-Hsing Chang, Chang-Ming Wu, Shih-Chang Liu +3 more | 2017-04-11 |
| 9618572 | Testing of semiconductor chips with microbumps | Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng, Chen-Hua Yu, Chao-Hsiang Yang | 2017-04-11 |
| 9613174 | Common template for electronic article | William Wu Shen, Yun-Han Lee, Chin-Chou Liu, Hsien-Hsin Sean Lee, Chung-Sheng Yuan +2 more | 2017-04-04 |
| 9589857 | Interposer test structures and methods | Tzuan-Horng Liu, Chen-Hua Yu, Hsien-Pin Hu, Tzu-Yu Wang, Shang-Yun Hou +1 more | 2017-03-07 |
| 9583591 | Si recess method in HKMG replacement gate technology | Harry-Hak-Lay Chuang, Chin-Yi Huang, Shih-Chang Liu, Chang-Ming Wu | 2017-02-28 |
| 9581638 | Chip-on-wafer process control monitoring for chip-on-wafer-on-substrate packages | Li-Han Hsu, Sao-Ling Chiu, Shang-Yun Hou, Shin-Puu Jeng, Chen-Hua Lin | 2017-02-28 |
| 9576645 | Three dimensional dual-port bit cell and method of using same | Wei Min Chan, Yen-Huei Chen | 2017-02-21 |
| 9576855 | Device and methods for high-k and metal gate stacks | Bao-Ru Young, Harry-Hak-Lay Chuang, Jin-Aun Ng, Po-Nien Chen | 2017-02-21 |
| 9570324 | Method of manufacturing package system | Shang-Yun Hou, Shin-Puu Jeng, Chen-Hua Yu | 2017-02-14 |
| 9570366 | Passivation layer for packaged chip | Shin-Puu Jeng, Shang-Yun Hou, Chen-Hua Yu, Tzuan-Horng Liu, Tzu-Wei Chiu +1 more | 2017-02-14 |
| 9559177 | Memory devices and method of fabricating same | Chang-Ming Wu, Shih-Chang Liu, Harry-Hak-Lay Chuang, Chia-Shiung Tsai | 2017-01-31 |
| 9558966 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Chien-Fu Tseng | 2017-01-31 |
| 9553053 | Bump structure for yield improvement | Tzu-Wei Chiu, Tzu-Yu Wang, Shang-Yun Hou, Shin-Puu Jeng, Hsien-Wei Chen +1 more | 2017-01-24 |
| 9543153 | Recess technique to embed flash memory in SOI technology | Harry-Hak-Lay Chuang, Kai-Shyang You | 2017-01-10 |
| 9536598 | Memory arrangement | Yen-Huei Chen, Hung-Jen Liao | 2017-01-03 |
| 9502343 | Dummy metal with zigzagged edges | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh +1 more | 2016-11-22 |