Issued Patents All Time
Showing 1,651–1,675 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8236583 | Method of separating light-emitting diode from a growth substrate | Ding-Yuan Chen, Hung-Ta Lin, Wen-Chih Chiou | 2012-08-07 |
| 8232201 | Schemes for forming barrier layers for copper in interconnect structures | Hai-Ching Chen, Tien-I Bao | 2012-07-31 |
| 8203209 | Bond pad design for reducing the effect of package stress | Shin-Puu Jeng, Hao-Yi Tsai, Hsien-Wei Chen | 2012-06-19 |
| 8198685 | Transistors with metal gate and methods for forming the same | Chung-Shi Liu, Yung-Sheng Chiu, Cheng-Tung Lin | 2012-06-12 |
| 8193087 | Process for improving copper line cap formation | Chien-Hsueh Shih, Minghsing Tsai, Ming-Shih Yeh | 2012-06-05 |
| 8169076 | Interconnect structures having lead-free solder bumps | Mirng-Ji Lii, Chien-Hsiun Lee, Shin-Puu Jeng, Chin-Yu Ku | 2012-05-01 |
| 8154038 | Group-III nitride for reducing stress caused by metal nitride reflector | Wen-Chih Chiou, Ding-Yuan Chen, Chia-Lin Yu | 2012-04-10 |
| 8148732 | Carbon-containing semiconductor substrate | Chia-Lin Yu, Ding-Yuan Chen, Wen-Chih Chiou, Hung-Ta Lin | 2012-04-03 |
| 8148826 | Three-dimensional integrated circuits with protection layers | Wen-Chih Chiou, Weng-Jin Wu, Hung-Jung Tu, Ku-Feng Yang | 2012-04-03 |
| 8143162 | Interconnect structure having a silicide/germanide cap layer | Yung-Cheng Lu, Hui-Lin Chang, Ting-Yu Shen, Hung Chun Tsai | 2012-03-27 |
| 8143114 | System and method for source/drain contact processing | Cheng-Hung Chang, Chen-Nan Yeh, Yu-Rung Hsu | 2012-03-27 |
| 8138076 | MOSFETs having stacked metal gate electrodes and method | Cheng-Tung Lin, Yung-Sheng Chiu, Hsiang-Yi Wang, Chia-Lin Yu | 2012-03-20 |
| 8134169 | Patterned substrate for hetero-epitaxial growth of group-III nitride film | Ding-Yuan Chen | 2012-03-13 |
| 8133097 | Polishing apparatus | Yu-Liang Lin, Chien Ling Hwang, Jean Wang | 2012-03-13 |
| 8134163 | Light-emitting diodes on concave texture substrate | Hung-Ta Lin, Wen-Chih Chiou, Ding-Yuan Chen, Chia-Lin Yu | 2012-03-13 |
| 8125052 | Seal ring structure with improved cracking protection | Shin-Puu Jeng, Shih-Hsun Hsu, Shang-Yun Hou, Hao-Yi Tsai | 2012-02-28 |
| 8119500 | Wafer bonding | Ku-Feng Yang, Weng-Jin Wu, Wen-Chih Chiou | 2012-02-21 |
| 8110890 | Method of fabricating semiconductor device isolation structure | Chen-Nan Yeh, Chu-Yun Fu, Ding-Yuan Chen | 2012-02-07 |
| 8109407 | Apparatus for storing substrates | Yi-Li Hsiao, Jean Wang, Jui-Pin Hung, Ming-Shih Yeh | 2012-02-07 |
| 8105875 | Approach for bonding dies onto interposers | Hsien-Pin Hu, Shin-Puu Jeng, Shang-Yun Hou, Jing-Cheng Lin, Wen-Chih Chiou +1 more | 2012-01-31 |
| 8106459 | FinFETs having dielectric punch-through stoppers | Cheng-Hung Chang, Chen-Nan Yeh | 2012-01-31 |
| 8106512 | Low resistance high reliability contact via and metal line structure for semiconductor device | Hsiang-Huan Lee, Ming-Han Lee, Ming-Shih Yeh, Shau-Lin Shue | 2012-01-31 |
| 8101052 | Adjustable anode assembly for a substrate wet processing apparatus | Yi-Li Hsiao, Jean Wang, Lawrance Sheu | 2012-01-24 |
| 8101994 | Semiconductor device having multiple fin heights | Chen-Nan Yeh, Yu-Rung Hsu | 2012-01-24 |
| 8058082 | Light-emitting diode with textured substrate | Wen-Chih Chiou, Ding-Yuan Chen, Chia-Lin Yu, Hung-Ta Lin | 2011-11-15 |