Issued Patents All Time
Showing 26–50 of 79 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508685 | Stacked semiconductor package | Jihwan Suh, Taehun Kim, Hyuekjae Lee, Jihwan Hwang, Sang Cheon Park | 2022-11-22 |
| 11488910 | Semiconductor package having redistribution layer | Young Kun Jee, Il Hwan Kim | 2022-11-01 |
| 11482554 | Semiconductor package and method of fabricating the same | Yungcheol Kong, Hyunsu Jun, Kyoungsei Choi | 2022-10-25 |
| 11315802 | Method for manufacturing semiconductor package having redistribution layer | Il Hwan Kim, Chung-Sun Lee | 2022-04-26 |
| 11302660 | Semiconductor devices and semiconductor packages including the same | Ju-Il Choi, Jin Ho An, Jongho Lee, Jeonggi Jin, Atsushi Fujisaki | 2022-04-12 |
| 11282792 | Semiconductor package having dummy pads and method of manufacturing semiconductor package having dummy pads | Young Kun Jee, Hae-Jung Yu, Sangwon Kim, Jongho Lee, Dae-Woo Kim +1 more | 2022-03-22 |
| 11227855 | Semiconductor package | Jang-woo Lee, Ji Hwang Kim, Jong Bo Shim, Young Kun Jee | 2022-01-18 |
| 11222873 | Semiconductor packages including stacked substrates and penetration electrodes | Joonho Jun, Sunkyoung Seo, Jongho Lee, Young Kun Jee | 2022-01-11 |
| 11114364 | Semiconductor package | Hee Jeong Kim, Juhyun Lyu, Jongho Lee | 2021-09-07 |
| 11069541 | Semiconductor device package for debonding substrate assembly from carrier substrate using light and method of manufacturing same | Yeong Kwon Ko, Jun Yeong Heo | 2021-07-20 |
| 11018026 | Interposer, semiconductor package, and method of fabricating interposer | Tae-Je Cho, Hyuek Jae Lee, Cha-Jea Jo | 2021-05-25 |
| 10930613 | Semiconductor package having recessed adhesive layer between stacked chips | Sang-Sick Park, Tae Hong Min, Teak-Hoon Lee, Ji Hwan Hwang | 2021-02-23 |
| 10868073 | Method of fabricating semiconductor package | Yungcheol Kong, Hyunsu Jun, Kyoungsei Choi | 2020-12-15 |
| 10818603 | Semiconductor package having redistribution layer | Young Kun Jee, II Hwan Kim | 2020-10-27 |
| 10804212 | Semiconductor device and package including modified region of less density at edge of device or substrate | Yeong Kwon Ko, Jun Yeong Heo, Ja-Yeon Lee | 2020-10-13 |
| 10756055 | Stacked image sensor package and stacked image sensor module including the same | Yungcheol Kong, Kyoungsei Choi | 2020-08-25 |
| 10685921 | Semiconductor chip module including a channel for controlling warpage and method of manufacturing the same | Young Kun Jee, Ji Hwang Kim | 2020-06-16 |
| 10535534 | Method of fabricating an interposer | Tae-Je Cho, Hyuek Jae Lee, Cha-Jea Jo | 2020-01-14 |
| 10262971 | Stacked image sensor package and stacked image sensor module including the same | Yungcheol Kong, Kyoungsei Choi | 2019-04-16 |
| 10177188 | Semiconductor package and method of fabricating the same | Yungcheol Kong, Hyunsu Jun, Kyoungsei Choi | 2019-01-08 |
| 10157766 | Method of fabricating a semiconductor device | Joonsik Sohn, Jung-Seok Ahn, Chungsun Lee, Taeje Cho | 2018-12-18 |
| 9941196 | Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device | Ho-Jin Lee, Tae-Je Cho, Dong-Hyeon Jang, Ho-Geon Song, Se-Young Jeong +1 more | 2018-04-10 |
| 9905538 | Chip-stacked semiconductor package and method of manufacturing the same | Tae-Je Cho, Byung-Hyug Roh | 2018-02-27 |
| 9905550 | Semiconductor package and method of fabricating the same | Sang-Uk Han, Seungwon Park, Taeje Cho | 2018-02-27 |
| 9761477 | Pre-package and methods of manufacturing semiconductor package and electronic device using the same | Gun-ho Chang, Tae-Je Cho | 2017-09-12 |