Issued Patents All Time
Showing 51–75 of 79 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9728424 | Method of fabricating a packaged integrated circuit with through-silicon via an inner substrate | Ji Hwang Kim, Cha-Jea Jo, Tae-Je Cho | 2017-08-08 |
| 9601465 | Chip-stacked semiconductor package and method of manufacturing the same | Tae-Je Cho, Byung-Hyug Roh | 2017-03-21 |
| 9595446 | Methods of processing substrates | Chungsun Lee, Jung-Hwan Kim, Kwang-chul Choi, Jeon Il Lee | 2017-03-14 |
| 9478514 | Pre-package and methods of manufacturing semiconductor package and electronic device using the same | Gun-ho Chang, Tae-Je Cho | 2016-10-25 |
| 9412636 | Methods for processing substrates | Chungsun Lee, Jung-Seok Ahn, Kwang-chul Choi, Jung-Hwan Kim, Joonsik Sohn +1 more | 2016-08-09 |
| 9376541 | Non-conductive film and non-conductive paste including zinc particles, semiconductor package including the same, and method of manufacturing the semiconductor package | Kyung Wook Paik, Tae-Je Cho, Young Kun Jee, Sun-kyoung Seo, Yong Won Choi +1 more | 2016-06-28 |
| 9343361 | Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device | Ho-Jin Lee, Tae-Je Cho, Dong-Hyeon Jang, Ho-Geon Song, Se-Young Jeong +1 more | 2016-05-17 |
| 9196505 | Semiconductor device and method of forming the same | Kwang-chul Choi, Jung-Hwan Kim, Tae Hong Min, Hojin Lee, Minseung Yoon | 2015-11-24 |
| 9076881 | Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package | Yun-Hyeok Im, Jong-Yeon Kim, Tae-Je Cho | 2015-07-07 |
| 9023716 | Methods for processing substrates | Chungsun Lee, Jung-Seok Ahn, Kwang-chul Choi, Jung-Hwan Kim, Joonsik Sohn +1 more | 2015-05-05 |
| 8890325 | Heterojunction structures of different substrates joined and methods of fabricating the same | Kwang-chul Choi, Jung-Hwan Kim, Tae Hong Min | 2014-11-18 |
| 8884416 | Semiconductor apparatus having through vias configured to isolate power supplied to a memory chip from data signals supplied to the memory chip | Go-Eun Lee, Taeje Cho, Seongmin Ryu, Jung-Hwan Kim, Tae Hong Min | 2014-11-11 |
| 8884421 | Multi-chip package and method of manufacturing the same | Jong-Joo Lee, Yong Hoon Kim, Tae Hong Min | 2014-11-11 |
| 8852988 | Semiconductor package and method of manufacturing the same | Hyung-Sun Jang, Woon-Seong Kwon, Tae-Je Cho, Jung-Hwan Kim | 2014-10-07 |
| 8643179 | Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package | Yun-Hyeok Im, Jong-Yeon Kim, Tae-Je Cho | 2014-02-04 |
| 8633579 | Multi-chip package and method of manufacturing the same | Jong-Joo Lee, Yong Hoon Kim, Tae Hong Min | 2014-01-21 |
| 8592991 | Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device | Ho-Jin Lee, Tae-Je Cho, Dong-Hyeon Jang, Ho-Geon Song, Se-Young Jeong +1 more | 2013-11-26 |
| 8563349 | Method of forming semiconductor device | Jong-Yun Myung, Hyuek Jae Lee, Ji-Sun Hong, Tae-Je Cho, Hyung-Sun Jang +3 more | 2013-10-22 |
| 8558371 | Method for wafer level package and semiconductor device fabricated using the same | JiSun Hong, Taeje Cho, Hyuekjae Lee, Youngbok Kim, Hyung-Sun Jang | 2013-10-15 |
| 8466527 | Semiconductor package and method of manufacturing the same | Hyung-Sun Jang, Woon-Seong Kwon, Tae-Je Cho, Jung-Hwan Kim | 2013-06-18 |
| 8450856 | Semiconductor device and method of forming the same | Kwang-chul Choi, Jung-Hwan Kim, Tae Hong Min, Hojin Lee, Minseung Yoon | 2013-05-28 |
| 8125042 | Semiconductor package and method of manufacturing the same | Jung-Hwan Kim, Dong Yi, Woonseong Kwon, Hyung-Sun Jang, Jongkeun Jeon +2 more | 2012-02-28 |
| 8114701 | Camera modules and methods of fabricating the same | Woon-Seong Kwon, Tae-Je Cho, Yong-Hwan Kwon, Chung-Sun Lee, Hyung-Sun Jang | 2012-02-14 |
| 7948555 | Camera module and electronic apparatus having the same | Yong-Hwan Kwon, Chung-Sun Lee, Woon-Seong Kwon, Hyung-Sun Jang | 2011-05-24 |
| 7893514 | Image sensor package, method of manufacturing the same, and image sensor module including the image sensor package | Woon-Seong Kwon, Yong-Hwan Kwon, Chung-Sun Lee, Hyung-Sun Jang | 2011-02-22 |