Issued Patents All Time
Showing 25 most recent of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854425 | Feedforward temperature control for plasma processing apparatus | Chetan Mahadeswaraswamy, Sergio Fukuda Shoji, Chunlei Zhang, Yashaswini B. Pattar, Duy D. Nguyen +7 more | 2020-12-01 |
| 9338871 | Feedforward temperature control for plasma processing apparatus | Chetan Mahadeswaraswamy, Sergio Fukuda Shoji, Chunlei Zhang, Yashaswini B. Pattar, Duy D. Nguyen +7 more | 2016-05-10 |
| 9214315 | Temperature control in plasma processing apparatus using pulsed heat transfer fluid flow | Fernando Silveira, Hamid Tavassoli, Xiaoping Zhou, Shane C. Nevil, Douglas A. Buchberger, Jr. +5 more | 2015-12-15 |
| 8916793 | Temperature control in plasma processing apparatus using pulsed heat transfer fluid flow | Fernando Silveira, Hamid Tavassoli, Xiaoping Zhou, Shane C. Nevil, Douglas A. Buchberger, Jr. +5 more | 2014-12-23 |
| 8632689 | Temperature control with stacked proportioning valve | — | 2014-01-21 |
| 8329593 | Method and apparatus for removing polymer from the wafer backside and edge | Imad Yousif, Anchel Sheyner, Ajit Balakrishna, Nancy Fung, Ying Rui +2 more | 2012-12-11 |
| 8313664 | Efficient and accurate method for real-time prediction of the self-bias voltage of a wafer and feedback control of ESC voltage in plasma processing chamber | Zhigang Chen, Shahid Rauf, Leonid Dorf, Kartik Ramaswamy, Kenneth S. Collins | 2012-11-20 |
| 8080479 | Plasma process uniformity across a wafer by controlling a variable frequency coupled to a harmonic resonator | Kenneth S. Collins, Hiroji Hanawa, Kartik Ramaswamy, Douglas A. Buchberger, Jr., Shahid Rauf +10 more | 2011-12-20 |
| 8076247 | Plasma process uniformity across a wafer by controlling RF phase between opposing electrodes | Kenneth S. Collins, Hiroji Hanawa, Kartik Ramaswamy, Douglas A. Buchberger, Jr., Shahid Rauf +10 more | 2011-12-13 |
| 7967996 | Process for wafer backside polymer removal and wafer front side photoresist removal | Kenneth S. Collins, Hiroji Hanawa, Andrew Nguyen, Shahid Rauf, Ajit Balakrishna +6 more | 2011-06-28 |
| 7968469 | Method of processing a workpiece in a plasma reactor with variable height ground return path to control plasma ion density uniformity | Kenneth S. Collins, Hiroji Hanawa, Kartik Ramaswamy, Douglas A. Buchberger, Jr., Shahid Rauf +10 more | 2011-06-28 |
| 7884025 | Plasma process uniformity across a wafer by apportioning ground return path impedances among plural VHF sources | Kenneth S. Collins, Hiroji Hanawa, Kartik Ramaswamy, Douglas A. Buchberger, Jr., Shahid Rauf +10 more | 2011-02-08 |
| 7879731 | Improving plasma process uniformity across a wafer by apportioning power among plural VHF sources | Kenneth S. Collins, Hiroji Hanawa, Kartik Ramaswamy, Douglas A. Buchberger, Jr., Shahid Rauf +10 more | 2011-02-01 |
| 7879183 | Apparatus and method for front side protection during backside cleaning | Imad Yousif, Ying Rui, Nancy Fung, Martin Jeffrey Salinas, Ajit Balakrishna +2 more | 2011-02-01 |
| 7554334 | Matching network characterization using variable impedance analysis | Steven C. Shannon, Daniel J. Hoffman, Steven Lane, Jivko Dinev | 2009-06-30 |
| 7358192 | Method and apparatus for in-situ film stack processing | Quanyuan Shang, John M. White | 2008-04-15 |
| 7056830 | Method for plasma etching a dielectric layer | Cecilia Y. Mak, Kam S. Law | 2006-06-06 |
| 6432830 | Semiconductor fabrication process | — | 2002-08-13 |
| 6355557 | Oxide plasma etching process with a controlled wineglass shape | James A. Stinnett, Cynthia B. Brooks, Jason Regis | 2002-03-12 |
| 6248206 | Apparatus for sidewall profile control during an etch process | Harald Herchen, Michael Welch, William R. Brown | 2001-06-19 |
| 6062237 | Polymer removal from top surfaces and sidewalls of a semiconductor wafer | William R. Brown, Harald Herchen, Michael Welch | 2000-05-16 |
| 6015761 | Microwave-activated etching of dielectric layers | William R. Brown, Harald Herchen, Michael Welch | 2000-01-18 |
| 5819434 | Etch enhancement using an improved gas distribution plate | Harald Herchen, William R. Brown | 1998-10-13 |
| 5789322 | Low volume gas distribution assembly for a chemical downstream etch tool | William R. Brown, Harald Herchen, Ihi Nzeadibe | 1998-08-04 |
| 5786276 | Selective plasma etching of silicon nitride in presence of silicon or silicon oxides using mixture of CH3F or CH2F2 and CF4 and O2 | Cynthia B. Brooks, Ajey M. Joshi, Gladys D. Quinones, Jitske Trevor | 1998-07-28 |