Issued Patents All Time
Showing 25 most recent of 224 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12418708 | Camera, A-pillar arrangement, and vehicle | Bernd Biehlman | 2025-09-16 |
| 12394697 | Method for fabricating a semiconductor device package comprising a pin in the form of a drilling screw | Thorsten Scharf, Thomas Bemmerl, Martin Gruber, Frank Singer | 2025-08-19 |
| 12237305 | Integrated circuit package having wirebonded multi-die stack | Pauli Jaervinen, Richard Patten | 2025-02-25 |
| 12184970 | Camera device, motor vehicle, method and computer program product | Harald Barth | 2024-12-31 |
| 12176222 | Semiconductor package with metal posts from structured leadframe | Chau Fatt Chiang, Chan Lam Cha, Wern Ken Daryl Wee, Chee Hong Lee, Swee Kah Lee +2 more | 2024-12-24 |
| 12158448 | Radiation source device | Derek Debie, Klaus Elian, Ludwig Heitzer, David Tumpold, Jens Pohl +3 more | 2024-12-03 |
| 12154886 | Semiconductor packages including electrical redistribution layers of different thicknesses and methods for manufacturing thereof | Martin Gruber, Thorsten Scharf | 2024-11-26 |
| 12136670 | Semiconductor device having contact trenches extending from opposite sides of a semiconductor body | Markus Zundel, Andreas Meiser, Hans-Peter Lang, Peter Irsigler | 2024-11-05 |
| 12094842 | Semiconductor device having an antenna arranged over an active main surface of a semiconductor die | Walter Hartner, Maciej Wojnowski | 2024-09-17 |
| 11984246 | Vertical inductor for WLCSP | Andreas Wolter, Gerhard Knoblinger | 2024-05-14 |
| 11955415 | Semiconductor device package comprising a pin in the form of a drilling screw | Thorsten Scharf, Thomas Bemmerl, Martin Gruber, Frank Singer | 2024-04-09 |
| 11862582 | Package with elevated lead and structure extending vertically from encapsulant bottom | Thomas Bemmerl, Martin Gruber, Martin Richard Niessner | 2024-01-02 |
| 11710684 | Package with separate substrate sections | Frank Singer, Martin Gruber, Thorsten Scharf, Peter Strobel, Stefan Woetzel | 2023-07-25 |
| 11652084 | Flat lead package formation method | Gerald Ofner, Stephan Bradl, Stefan Miethaner, Alexander Heinrich, Horst Theuss +1 more | 2023-05-16 |
| 11552048 | Semiconductor device including an electrical contact with a metal layer arranged thereon | Oliver Hellmund, Barbara Eichinger, Ingo Muri | 2023-01-10 |
| 11531056 | Predictive chip-maintenance | Irmgard Escher-Poeppel, Gerhard Poeppel | 2022-12-20 |
| 11515244 | Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture | Bun Kian Tay, Mei Yih Goh, Martin Gruber, Josef Hoeglauer, Michael Juerss +3 more | 2022-11-29 |
| 11502042 | Processing of one or more carrier bodies and electronic components by multiple alignment | Thomas Behrens, Martin Gruber, Thorsten Scharf, Peter Strobel | 2022-11-15 |
| 11393742 | Method for fabricating a semiconductor flip-chip package | Irmgard Escher-Poeppel, Klaus Pressel, Bernd Rakow | 2022-07-19 |
| 11387533 | Semiconductor package with plastic waveguide | Maciej Wojnowski, Dirk Hammerschmidt, Walter Hartner, Johannes Lodermeyer, Chiara Mariotti | 2022-07-12 |
| 11302668 | Multi-purpose non-linear semiconductor package assembly line | Gerald Ofner, Stephan Bradl, Stefan Miethaner, Alexander Heinrich, Horst Theuss +1 more | 2022-04-12 |
| 11264356 | Batch manufacture of packages by sheet separated into carriers after mounting of electronic components | Thomas Behrens, Andreas Grassmann, Martin Gruber, Thorsten Scharf | 2022-03-01 |
| 11250981 | Vertical inductor for WLCSP | Andreas Wolter, Gerhard Knoblinger | 2022-02-15 |
| 11171066 | Semiconductor panels, semiconductor packages, and methods for manufacturing thereof | Andreas Grassmann | 2021-11-09 |
| 11081455 | Semiconductor device with bond pad extensions formed on molded appendage | Chan Lam Cha, Wei Han Koo, Klaus Schiess, Guan Choon Matthew Nelson Tee | 2021-08-03 |