Issued Patents All Time
Showing 25 most recent of 199 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE50494 | Self-forming embedded diffusion barriers | Cyril Cabral, Jr., Daniel C. Edelstein, Juntao Li | 2025-07-15 |
| 12136655 | Backside electrical contacts to buried power rails | Ruilong Xie, Brent A. Anderson, Albert M. Young, Kangguo Cheng, Julien Frougier +2 more | 2024-11-05 |
| 12106969 | Substrate thinning for a backside power distribution network | Ruilong Xie, Balasubramanian Pranatharthiharan, Mukta G. Farooq, Julien Frougier, Roy R. Yu +1 more | 2024-10-01 |
| 12087685 | Semiconductor interconnect structure with double conductors | Benjamin D. Briggs, Raghuveer R. Patlolla | 2024-09-10 |
| 12002758 | Backside metal-insulator-metal (MIM) capacitors extending through backside interlayer dielectric (BILD) layer or semiconductor layer and partly through dielectric layer | Ruilong Xie, Roy R. Yu, Balasubramanian Pranatharthiharan, Chih-Chao Yang | 2024-06-04 |
| 11942426 | Semiconductor structure having alternating selective metal and dielectric layers | Son V. Nguyen, Balasubramanian Pranatharthiharan | 2024-03-26 |
| 11915966 | Backside power rail integration | Ruilong Xie, Roy R. Yu, Balasubramanian Pranatharthiharan, Albert M. Young, Kisik Choi +1 more | 2024-02-27 |
| 11908734 | Composite interconnect formation using graphene | Son V. Nguyen, Balasubramanian Pranatharthiharan | 2024-02-20 |
| 11804405 | Method of forming copper interconnect structure with manganese barrier layer | Daniel C. Edelstein, Son V. Nguyen, Deepika Priyadarshini, Hosadurga Shobha | 2023-10-31 |
| 11749602 | Topological semi-metal interconnects | Ching-Tzu Chen, Nicholas Anthony Lanzillo, Vijay Narayanan | 2023-09-05 |
| 11587830 | Self-forming barrier for use in air gap formation | Benjamin D. Briggs, Elbert E. Huang, Christopher J. Penny | 2023-02-21 |
| 11400547 | Laser machine | — | 2022-08-02 |
| 11348872 | Hybrid dielectric scheme for varying liner thickness and manganese concentration | Benjamin D. Briggs, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Christopher J. Penny, Michael Rizzolo | 2022-05-31 |
| 11318559 | Laser machining system | — | 2022-05-03 |
| 11302637 | Interconnects including dual-metal vias | Balasubramanian S. Pranatharthi Haran, Devika Sil | 2022-04-12 |
| 11232983 | Copper interconnect structure with manganese barrier layer | Daniel C. Edelstein, Son V. Nguyen, Deepika Priyadarshini, Hosadurga Shobha | 2022-01-25 |
| 11189528 | Subtractive RIE interconnect | John C. Arnold, Balasubramanian S. Pranatharthi Haran | 2021-11-30 |
| 11177167 | Ultrathin multilayer metal alloy liner for nano Cu interconnects | Daniel C. Edelstein, Alfred Grill, Seth L. Knupp, Son V. Nguyen, Vamsi K. Paruchuri +2 more | 2021-11-16 |
| 11164776 | Metallic interconnect structure | Son V. Nguyen, Thomas J. Haigh, Jr., Cornelius Brown Peethala, Matthew T. Shoudy | 2021-11-02 |
| 10978393 | Hybrid dielectric scheme for varying liner thickness and manganese concentration | Benjamin D. Briggs, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Christopher J. Penny, Michael Rizzolo | 2021-04-13 |
| 10978342 | Interconnect with self-forming wrap-all-around barrier layer | Huai Huang, Alfred Grill, Benjamin D. Briggs, Nicholas Anthony Lanzillo, Christian Lavoie +3 more | 2021-04-13 |
| 10804193 | Semiconductor interconnect structure with double conductors | Benjamin D. Briggs, Raghuveer R. Patlolla | 2020-10-13 |
| 10770347 | Interconnect structure | Daniel C. Edelstein, Son V. Nguyen, Deepika Priyadarshini, Hosadurga Shobha | 2020-09-08 |
| 10763166 | Self-forming barrier for use in air gap formation | Benjamin D. Briggs, Elbert E. Huang, Christopher J. Penny | 2020-09-01 |
| 10685879 | Lithographic alignment of a conductive line to a via | John C. Arnold, Ashim Dutta, Dominik Metzler | 2020-06-16 |