Issued Patents All Time
Showing 1–25 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406914 | Ultra-thin, hyper-density semiconductor packages | Debendra Mallik, Robert L. Sankman, Robert M. Nickerson, Mitul Modi, Sanka Ganesan +4 more | 2025-09-02 |
| 12388019 | Pitch translation architecture for semiconductor package including embedded interconnect bridge | Andrew Collins, Bharat P. Penmecha, Ram Viswanath | 2025-08-12 |
| 12080632 | Glass core package substrates | Deepak Kulkarni, Rahul Agarwal, Chintan Buch | 2024-09-03 |
| 12051647 | Pitch translation architecture for semiconductor package including embedded interconnect bridge | Andrew Collins, Bharat P. Penmecha, Ram Viswanath | 2024-07-30 |
| 11817364 | BGA STIM package architecture for high performance systems | Mukul Renavikar | 2023-11-14 |
| 11742293 | Multiple die package using an embedded bridge connecting dies | Yidnekachew S. Mekonnen, Kemel Aygun, Ravindranath V. Mahajan, Christopher S. Baldwin | 2023-08-29 |
| 11705398 | Pitch translation architecture for semiconductor package including embedded interconnect bridge | Andrew Collins, Bharat P. Penmecha, Ram Viswanath | 2023-07-18 |
| 11532563 | Package integration using fanout cavity substrate | Karthik Shanmugam, Jun Zhai | 2022-12-20 |
| 11430724 | Ultra-thin, hyper-density semiconductor packages | Debendra Mallik, Robert L. Sankman, Robert M. Nickerson, Mitul Modi, Sanka Ganesan +4 more | 2022-08-30 |
| 11398692 | Socket with integrated flex connector | Mahesh S. Hardikar, David A. Secker, Ravindranath Kollipara, Robert R. Atkinson | 2022-07-26 |
| 11296050 | Chip with magnetic interconnect alignment | — | 2022-04-05 |
| 11270942 | Pitch translation architecture for semiconductor package including embedded interconnect bridge | Andrew Collins, Bharat P. Penmecha, Ram Viswanath | 2022-03-08 |
| 10784204 | Rlink—die to die channel interconnect configurations to improve signaling | Kemal Aygun, Richard J. Dischler, Jeff C. Morriss, Zhiguo Qian, Wilfred Gomes +7 more | 2020-09-22 |
| 10643945 | Pitch translation architecture for semiconductor package including embedded interconnect bridge | Andrew Collins, Bharat P. Penmecha, Ram Viswanath | 2020-05-05 |
| 10187996 | Printed circuit board with a recess to accommodate discrete components in a package | Ram Viswanath | 2019-01-22 |
| 10074920 | Interconnect cable with edge finger connector | Donald T. Tran | 2018-09-11 |
| 9847308 | Magnetic intermetallic compound interconnect | Ravindranath V. Mahajan | 2017-12-19 |
| 9832876 | CPU package substrates with removable memory mechanical interfaces | Mani N. Prakash, Thomas T. Holden, Jeffory L. Smalley, Ram Viswanath, Bassam N. Coury +11 more | 2017-11-28 |
| 9793233 | Forming sacrificial composite materials for package-on-package architectures and structures formed thereby | Leonel Arana, Yoshihiro Tomita, Yosuke Kanaoka | 2017-10-17 |
| 9674954 | Chip package connector assembly | Donald T. Tran, Brent Stone, Ram Viswanath | 2017-06-06 |
| 9615483 | Techniques and configurations associated with a package load assembly | Gaurav Chawla, Joshua D. Heppner, Vijaykumar Krithivasan, Michael Garcia, Kuang Liu | 2017-04-04 |
| 9603247 | Electronic package with narrow-factor via including finish layer | Sairam Agraharam, Amruthavalli Pallavi Alur, Ram Viswanath, Wei-Lun Kane Jen | 2017-03-21 |
| 9502800 | Double-mated edge finger connector | Donald T. Tran, Srikant Nekkanty | 2016-11-22 |
| 9478881 | Snap connector for socket assembly and associated techniques and configurations | Zhichao Zhang, Gaurav Chawla, Kemal Aygun, Li Sun | 2016-10-25 |
| 9472519 | Forming sacrificial composite materials for package-on-package architectures and structures formed thereby | Leonel Arana, Yoshihiro Tomita, Yosuke Kanaoka | 2016-10-18 |