Issued Patents All Time
Showing 76–100 of 113 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9129817 | Magnetic core inductor (MCI) structures for integrated voltage regulators | Adel A. Elsherbini, Henning Braunisch, Krishna Bharath | 2015-09-08 |
| 8803283 | Vertical meander inductor for small core voltage regulators | Christopher J. Jezewski | 2014-08-12 |
| 8513111 | Forming semiconductor structures | Robert Meagley, Tian-An Chen, Michael Goodner, James M. Powers, Huey-Chiang Liou | 2013-08-20 |
| 8421225 | Three-dimensional stacked substrate arrangements | Shriram Ramanathan, Patrick Morrow, Scott List, Michael Chan, Mauro J. Kobrinsky +3 more | 2013-04-16 |
| 8203208 | Three-dimensional stacked substrate arrangements | Shriram Ramanathan, Patrick Morrow, Scott List, Michael Chan, Mauro J. Kobrinsky +3 more | 2012-06-19 |
| 7973407 | Three-dimensional stacked substrate arrangements | Shriram Ramanathan, Patrick Morrow, Scott List, Michael Chan, Mauro J. Kobrinsky +3 more | 2011-07-05 |
| 7867891 | Dual metal interconnects for improved gap-fill, reliability, and reduced capacitance | Rohan Akolkar, Tejaswi K. Indukuri, Arnel M. Fajardo | 2011-01-11 |
| 7843070 | Nanotube and metal composite interconnects | — | 2010-11-30 |
| 7723008 | Photoactive adhesion promoter in a slam | Robert Meagley, Heidi Cao | 2010-05-25 |
| 7718528 | Photoactive adhesion promoter in a SLAM | Robert Meagley, Heidi Cao | 2010-05-18 |
| 7658975 | Sealing porous dielectric materials | Grant Kloster, Robert Meagley, Michael Goodner | 2010-02-09 |
| 7629252 | Conformal electroless deposition of barrier layer materials | Chin-Chang Cheng, Ramanan V. Chebiam, Valery M. Dubin, Sridhar Balakrishnan | 2009-12-08 |
| 7572732 | Method to modulate etch rate in SLAM | Michael Goodner, Robert Meagley | 2009-08-11 |
| 7560165 | Sealing porous dielectric materials | Grant Kloster, Robert Meagley, Michael Goodner, Don Bruner | 2009-07-14 |
| 7550385 | Amine-free deposition of metal-nitride films | Adrien LaVoie, Valery M. Dubin, Juan E. Dominguez, Steven W. Johnston, John D. Peck +2 more | 2009-06-23 |
| 7518244 | Reducing line to line capacitance using oriented dielectric films | David H. Gracias | 2009-04-14 |
| 7402509 | Method of forming self-passivating interconnects and resulting devices | Mauro J. Kobrinsky, Jun He, Patrick Morrow, Ying Zhou, Shriram Ramanathan | 2008-07-22 |
| 7344972 | Photosensitive dielectric layer | Michael Goodner, Grant Kloster, Robert Meagley | 2008-03-18 |
| 7335587 | Post polish anneal of atomic layer deposition barrier layers | Steven W. Johnston, Sridhar Balakrishnan | 2008-02-26 |
| 7294568 | Formation of air gaps in an interconnect structure using a thin permeable hard mask and resulting structures | Michael Goodner, Grant Kloster | 2007-11-13 |
| 7238604 | Forming thin hard mask over air gap or porous dielectric | Grant Kloster, David H. Gracias, Hyun-Mog Park, Vijayakumar Ramachandrarao | 2007-07-03 |
| 7220671 | Organometallic precursors for the chemical phase deposition of metal films in interconnect applications | Harsono S. Simka, Juan E. Dominguez, Steven W. Johnston, Adrien LaVoie | 2007-05-22 |
| 7126223 | Semiconductor device formed with an air gap using etch back of inter layer dielectric (ILD) | James M. Powers | 2006-10-24 |
| 7119019 | Capping of copper structures in hydrophobic ILD using aqueous electro-less bath | Justin K. Brask | 2006-10-10 |
| 7109557 | Sacrificial dielectric planarization layer | Chris Barns, Anne Miller | 2006-09-19 |