Issued Patents All Time
Showing 51–75 of 99 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7056837 | Process of insulating a semiconductor device using a polymeric material | John M. Cotte, Kenneth McCullough, Wayne M. Moreau, Kevin S. Petrarca, John P. Simons +1 more | 2006-06-06 |
| 7053460 | Multi-level RF passive device | Seshadri Subbanna, Robert A. Groves, John C. Malinowski, Kenneth J. Stein, Kevin S. Petrarca | 2006-05-30 |
| 7005371 | Method of forming suspended transmission line structures in back end of line processing | Anil K. Chinthakindi, Robert A. Groves, Youri V. Tretiakov, Kunal Vaed | 2006-02-28 |
| 6995475 | I/C chip suitable for wire bonding | Julie C. Biggs, Tien-Jen Cheng, David E. Eichstadt, Lisa A. Fanti, Jonathan H. Griffith +6 more | 2006-02-07 |
| 6992344 | Damascene integration scheme for developing metal-insulator-metal capacitors | Douglas D. Coolbaugh, John M. Cotte, Ebenezer E. Eshun, Kenneth J. Stein, Kunal Vaed | 2006-01-31 |
| 6992368 | Production of metal insulator metal (MIM) structures using anodizing process | John M. Cotte, Kevin S. Petrarca, Kenneth J. Stein | 2006-01-31 |
| 6982493 | Wedgebond pads having a nonplanar surface structure | Kevin S. Petrarca | 2006-01-03 |
| 6979884 | Bipolar transistor having self-aligned silicide and a self-aligned emitter contact border | David C. Ahlgren, Gregory G. Freeman, Marwan H. Khater | 2005-12-27 |
| 6933186 | Method for BEOL resistor tolerance improvement using anodic oxidation | John M. Cotte, Kenneth J. Stein, Seshadri Subbanna | 2005-08-23 |
| 6927472 | Fuse structure and method to form the same | David K. Anderson, Tien-Jen Cheng, Timothy J. Dalton, Christopher V. Jahnes, Andrew Lu +3 more | 2005-08-09 |
| 6924185 | Fuse structure and method to form the same | David K. Anderson, Tien-Jen Cheng, Timothy J. Dalton, Christopher V. Jahnes, Andrew Lu +3 more | 2005-08-02 |
| 6873027 | Encapsulated energy-dissipative fuse for integrated circuits and method of making the same | Timothy J. Dalton, Kevin S. Petrarca | 2005-03-29 |
| 6864578 | Internally reinforced bond pads | David Angell, Frederic Beaulieu, Takashi Hisada, Adreanne Kelly, Samuel McKnight +4 more | 2005-03-08 |
| 6836029 | Micro-electromechanical switch having a conductive compressible electrode | David R. Greenberg, Hariklia Deligianni, Robert A. Groves, Christopher V. Jahnes, Jennifer Lund +1 more | 2004-12-28 |
| 6834671 | Check valve for micro electro mechanical structure devices | John M. Cotte, Kenneth McCullough, Wayne M. Moreau, John P. Simons, Charles J. Taft | 2004-12-28 |
| 6831542 | Micro-electromechanical inductive switch | John E. Florkey, Robert A. Groves | 2004-12-14 |
| 6831363 | Structure and method for reducing thermo-mechanical stress in stacked vias | Timothy J. Dalton, Sanjit Das, Brett H. Engel, Brian Herbst, Habib Hichri +8 more | 2004-12-14 |
| 6825075 | Method of fabricating MIM capacitor with the encapsulated metal structure serving as the lower plate | Kevin S. Petrarca, Donald F. Canaperi, Mahadevaiyer Krishnan, Kenneth J. Stein | 2004-11-30 |
| 6819000 | High density area array solder microjoining interconnect structure and fabrication method | John Harold Magerlein, Kevin S. Petrarca, Sampath Purushothaman, Carlos J. Sambucetti, George F. Walker | 2004-11-16 |
| 6815813 | Self-contained heat sink and a method for fabricating same | Timothy J. Dalton, Kevin S. Petrarca, Michelle L. Steen, Cornelia K. Tsang | 2004-11-09 |
| 6800503 | MEMS encapsulated structure and method of making same | Joseph T. Kocis, James A. Tornello, Kevin S. Petrarca, Seshadri Subbanna | 2004-10-05 |
| 6798029 | Method of fabricating micro-electromechanical switches on CMOS compatible substrates | John C. Bisson, Donna R. Cote, Timothy J. Dalton, Robert A. Groves, Kevin S. Petrarca +2 more | 2004-09-28 |
| 6762667 | Micro electromechanical switch having self-aligned spacers | David Angell, Donald F. Canaperi, Joseph T. Kocis, Kevin S. Petrarca, Kenneth J. Stein +1 more | 2004-07-13 |
| 6756624 | Encapsulated metal structures for semiconductor devices and MIM capacitors including the same | Kevin S. Petrarca, Donald F. Canaperi, Mahadevaiyer Krishnan, Kenneth J. Stein | 2004-06-29 |
| 6747472 | Temporary device attach structure for test and burn in of microjoint interconnects and method for fabricating the same | John Harold Magerlein, Samuel McKnight, Kevin S. Petrarca, Sampath Purushothaman, Carlos J. Sambucetti +2 more | 2004-06-08 |