Issued Patents All Time
Showing 26–50 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7581314 | Method of forming noble metal contacts | Hariklia Deligianni, Panayotis Andricacos, L. Paivikki Buchwalter, John M. Cotte, Christopher V. Jahnes +5 more | 2009-09-01 |
| 7544610 | Method and process for forming a self-aligned silicide contact | Cyril Cabral, Jr., Michael A. Cobb, Asa Frye, Balasubramanian S. Pranatharthi Haran, Randolph F. Knarr +5 more | 2009-06-09 |
| 7407605 | Manufacturable CoWP metal cap process for copper interconnects | Darryl D. Restaino, Donald F. Canaperi, Judith M. Rubino, Sean Smith, Richard O. Henry +1 more | 2008-08-05 |
| 7253106 | Manufacturable CoWP metal cap process for copper interconnects | Darryl D. Restaino, Donald F. Canaperi, Judith M. Rubino, Sean Smith, Richard O. Henry +1 more | 2007-08-07 |
| 7202764 | Noble metal contacts for micro-electromechanical switches | Hariklia Deligianni, Panayotis Andricacos, L. Paivikki Buchwalter, John M. Cotte, Christopher V. Jahnes +5 more | 2007-04-10 |
| 7190079 | Selective capping of copper wiring | Panayotis Andricacos, Shyng-Tsong Chen, John M. Cotte, Hariklia Deligianni, Wei-Tsu Tseng +1 more | 2007-03-13 |
| 7064064 | Copper recess process with application to selective capping and electroless plating | Shyng-Tsong Chen, Timothy J. Dalton, Kenneth M. Davis, Chao-Kun Hu, Fen F. Jamin +11 more | 2006-06-20 |
| 7045453 | Very low effective dielectric constant interconnect structures and methods for fabricating the same | Donald F. Canaperi, Timothy J. Dalton, Stephen M. Gates, Satya V. Nitta, Sampath Purushothaman +1 more | 2006-05-16 |
| 7023093 | Very low effective dielectric constant interconnect Structures and methods for fabricating the same | Donald F. Canaperi, Timothy J. Dalton, Stephen M. Gates, Satya V. Nitta, Sampath Purushothaman +1 more | 2006-04-04 |
| 7008871 | Selective capping of copper wiring | Panayotis Andricacos, Shyng-Tsong Chen, John M. Cotte, Hariklia Deligianni, Wei-Tsu Tseng +1 more | 2006-03-07 |
| 6975032 | Copper recess process with application to selective capping and electroless plating | Shyng-Tsong Chen, Timothy J. Dalton, Kenneth M. Davis, Chao-Kun Hu, Fen F. Jamin +11 more | 2005-12-13 |
| 6825075 | Method of fabricating MIM capacitor with the encapsulated metal structure serving as the lower plate | Kevin S. Petrarca, Donald F. Canaperi, Kenneth J. Stein, Richard P. Volant | 2004-11-30 |
| 6812193 | Slurry for mechanical polishing (CMP) of metals and use thereof | Michael T. Brigham, Donald F. Canaperi, Michael A. Cobb, William J. Cote, Kenneth M. Davis +9 more | 2004-11-02 |
| 6756624 | Encapsulated metal structures for semiconductor devices and MIM capacitors including the same | Kevin S. Petrarca, Donald F. Canaperi, Kenneth J. Stein, Richard P. Volant | 2004-06-29 |
| 6743642 | Bilayer CMP process to improve surface roughness of magnetic stack in MRAM technology | Gregory Costrini, John P. Hummel, Kia-Seng Low | 2004-06-01 |
| 6656369 | Method for fabricating a scanning probe microscope probe | Mark E. Lagus, Kevin S. Petrarca, James G. Ryan, Richard P. Volant | 2003-12-02 |
| 6597068 | Encapsulated metal structures for semiconductor devices and MIM capacitors including the same | Kevin S. Petrarca, Donald F. Canaperi, Kenneth J. Stein, Richard P. Volant | 2003-07-22 |
| 6503834 | Process to increase reliability CuBEOL structures | Xiaomeng Chen, Judith M. Rubino, Carlos J. Sambucetti, Soon-Cheon Seo, James A. Tornello | 2003-01-07 |
| 6368953 | Encapsulated metal structures for semiconductor devices and MIM capacitors including the same | Kevin S. Petrarca, Donald F. Canaperi, Kenneth J. Stein, Richard P. Volant | 2002-04-09 |
| 6361402 | Method for planarizing photoresist | Donald F. Canaperi, Rangarajan Jagannathan, Max G. Levy, Uma Satyendra, Matthew Sendelbach +2 more | 2002-03-26 |
| 6358832 | Method of forming barrier layers for damascene interconnects | Daniel C. Edelstein, Timothy J. Dalton, John G. Gaudiello, Sandra G. Malhotra, Maurice McGlashan-Powell +2 more | 2002-03-19 |
| 6348076 | Slurry for mechanical polishing (CMP) of metals and use thereof | Donald F. Canaperi, William J. Cote, Paul M. Feeney, Joyce C. Liu, Michael F. Lofaro +2 more | 2002-02-19 |
| 6190237 | pH-buffered slurry and use thereof for polishing | Cuc K. Huynh, Michael MacDonald, Mark P. Murray | 2001-02-20 |
| 6153935 | Dual etch stop/diffusion barrier for damascene interconnects | Daniel C. Edelstein, Timothy J. Dalton, John G. Gaudiello, Sandra G. Malhotra, Maurice McGlashan-Powell +2 more | 2000-11-28 |
| 6114249 | Chemical mechanical polishing of multiple material substrates and slurry having improved selectivity | Donald F. Canaperi, Rangarajan Jagannathan, Clifford Owen Morgan, III, Terrance M. Wright | 2000-09-05 |