Issued Patents All Time
Showing 101–125 of 157 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7098476 | Multilayer interconnect structure containing air gaps and method for making | Katherina Babich, Roy A. Carruthers, Timothy J. Dalton, Alfred Grill, Jeffrey Hedrick +4 more | 2006-08-29 |
| 7071122 | Field effect transistor with etched-back gate dielectric | Rajarao Jammy, Vijay Narayanan | 2006-07-04 |
| 7064050 | Metal carbide gate structure and method of fabrication | Cyril Cabral, Jr., Christophe Detavernier, Rajarao Jammy | 2006-06-20 |
| 7064064 | Copper recess process with application to selective capping and electroless plating | Shyng-Tsong Chen, Timothy J. Dalton, Kenneth M. Davis, Chao-Kun Hu, Fen F. Jamin +11 more | 2006-06-20 |
| 7060585 | Hybrid orientation substrates by in-place bonding and amorphization/templated recrystallization | Guy M. Cohen | 2006-06-13 |
| 7038277 | Transferable device-containing layer for silicon-on-insulator applications | Jack O. Chu, Alfred Grill, Dean A. Herman, Jr. | 2006-05-02 |
| 6975032 | Copper recess process with application to selective capping and electroless plating | Shyng-Tsong Chen, Timothy J. Dalton, Kenneth M. Davis, Chao-Kun Hu, Fen F. Jamin +11 more | 2005-12-13 |
| 6972440 | Enhanced T-gate structure for modulation doped field effect transistors | Dinkar Singh, Vishnubhai V. Patel, Alfred Grill, Steven J. Koester | 2005-12-06 |
| 6967131 | Field effect transistor with electroplated metal gate | Cyril Cabral, Jr., Emanuel I. Cooper, Hariklia Deligianni, Panayotis Andricacos, Philippe M. Vereecken | 2005-11-22 |
| 6930034 | Robust ultra-low k interconnect structures using bridge-then-metallization fabrication sequence | Matthew E. Colburn, Elbert E. Huang, Satyanarayana V. Nitta, Sampath Purushothaman | 2005-08-16 |
| 6870232 | Scalable MOS field effect transistor | Kevin K. Chan, Jack O. Chu, Khalid EzzEldin Ismail, Stephen A. Rishton | 2005-03-22 |
| 6836029 | Micro-electromechanical switch having a conductive compressible electrode | David R. Greenberg, Hariklia Deligianni, Robert A. Groves, Christopher V. Jahnes, Jennifer Lund +1 more | 2004-12-28 |
| 6815329 | Multilayer interconnect structure containing air gaps and method for making | Katherina Babich, Roy A. Carruthers, Timothy J. Dalton, Alfred Grill, Jeffrey Hedrick +4 more | 2004-11-09 |
| 6773982 | Feram cell with internal oxygen source and method of oxygen release | Charles T. Black, Cyril Cabral, Jr., Alfred Grill, Deborah A. Neumayer, Wilbur D. Pricer +1 more | 2004-08-10 |
| 6774010 | Transferable device-containing layer for silicon-on-insulator applications | Jack O. Chu, Alfred Grill, Dean A. Herman, Jr. | 2004-08-10 |
| 6759321 | Stabilization of fluorine-containing low-k dielectrics in a metal/insulator wiring structure by ultraviolet irradiation | Katherina Babich, Alessandro C. Callegari, Stephen A. Cohen, Alfred Grill, Christopher V. Jahnes +2 more | 2004-07-06 |
| 6740535 | Enhanced T-gate structure for modulation doped field effect transistors | Dinkar Singh, Vishnubhai V. Patel, Alfred Grill, Steven J. Koester | 2004-05-25 |
| 6737725 | Multilevel interconnect structure containing air gaps and method for making | Alfred Grill, Jeffrey Hedrick, Christopher V. Jahnes, Satyanarayana V. Nitta, Kevin S. Petrarca +2 more | 2004-05-18 |
| 6727174 | Method for fabricating a dual-diameter electrical conductor | David E. Kotecki | 2004-04-27 |
| 6577011 | Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same | Leena Paivikki Buchwalter, Alessandro C. Callegari, Stephan A. Cohen, Teresita O. Graham, John P. Hummel +3 more | 2003-06-10 |
| 6555859 | Flip FERAM cell and method to form same | James W. Adkisson, Charles T. Black, Alfred Grill, Randy W. Mann, Deborah A. Neumayer +2 more | 2003-04-29 |
| 6448655 | Stabilization of fluorine-containing low-k dielectrics in a metal/insulator wiring structure by ultraviolet irradiation | Katherina Babich, Alessandro C. Callegari, Stephen A. Cohen, Alfred Grill, Christopher V. Jahnes +2 more | 2002-09-10 |
| 6448176 | Dual damascene processing for semiconductor chip interconnects | Alfred Grill, John P. Hummel, Christopher V. Jahnes, Vishnubhai V. Patel | 2002-09-10 |
| 6432725 | Methods for crystallizing metallic oxide dielectric films at low temperature | Jingyu Lian, Kwong Hon Wong, Chenting Lin | 2002-08-13 |
| 6413852 | Method of forming multilevel interconnect structure containing air gaps including utilizing both sacrificial and placeholder material | Alfred Grill, Jeffrey Hedrick, Christopher V. Jahnes, Satyanarayana V. Nitta, Kevin S. Petrarca +2 more | 2002-07-02 |