KS

Katherine L. Saenger

IBM: 154 patents #272 of 70,183Top 1%
KT King Abdulaziz City For Science And Technology: 7 patents #22 of 573Top 4%
Globalfoundries: 3 patents #1,029 of 4,424Top 25%
Infineon Technologies Ag: 2 patents #4,439 of 7,486Top 60%
TC Toshiba America Electronic Components: 1 patents #23 of 77Top 30%
📍 Ossining, NY: #6 of 613 inventorsTop 1%
🗺 New York: #232 of 115,490 inventorsTop 1%
Overall (All Time): #5,648 of 4,157,543Top 1%
157
Patents All Time

Issued Patents All Time

Showing 51–75 of 157 patents

Patent #TitleCo-InventorsDate
8441042 BEOL compatible FET structure Christy S. Tyberg, Jack O. Chu, Harold J. Hovel, Robert L. Wisnieff, Kerry Bernstein +1 more 2013-05-14
8298923 Germanium-containing release layer for transfer of a silicon layer to a substrate Stephen W. Bedell, Keith E. Fogel, Daniel A. Inns, Jeehwan Kim, Devendra K. Sadana 2012-10-30
8288237 TiC as a thermally stable p-metal carbide on high k SiO2 gate stacks Alessandro C. Callegari, Michael A. Gribelyuk, Dianne L. Lacey, Fenton R. Feeney, Sufi Zafar 2012-10-16
8241970 CMOS with channel P-FinFET and channel N-FinFET having different crystalline orientations and parallel fins Guy M. Cohen 2012-08-14
8236636 Hybrid orientation semiconductor structure with reduced boundary defects and method of forming same Haizhou Yin, John A. Ott, Chun-Yung Sung 2012-08-07
8138061 Quasi-hydrophobic Si-Si wafer bonding using hydrophilic Si surfaces and dissolution of interfacial bonding oxide Joel P. de Souza, John A. Ott, Alexander Reznicek, Devendra K. Sadana 2012-03-20
8084319 Precisely tuning feature sizes on hard masks via plasma treatment Hongbo Peng, Stephen M. Rossnagel 2011-12-27
8053330 Quasi-hydrophobic Si-Si wafer bonding using hydrophilic Si surfaces and dissolution of interfacial bonding oxide Joel P. de Souza, John A. Ott, Alexander Reznicek, Devendra K. Sadana 2011-11-08
8030145 Back-gated fully depleted SOI transistor Leland Chang, Brian L. Ji, Arvind Kumar, Amlan Majumdar, Leathen Shi +1 more 2011-10-04
7999319 Trench-edge-defect-free recrystallization by edge-angle-optimized solid phase epitaxy: method and applications to hybrid orientation substrates Chun-Yung Sung, Haizhou Yin 2011-08-16
7977712 Asymmetric source and drain field effect structure Huilong Zhu, Hong Lin, Kai Xiu, Haizhou Yin 2011-07-12
7968459 Ion implantation combined with in situ or ex situ heat treatment for improved field effect transistors Stephen W. Bedell, Joel P. Desouza, Zhibin Ren, Alexander Reznicek, Devandra K. Sadana +1 more 2011-06-28
7960263 Amorphization/templated recrystallization method for hybrid orientation substrates Keith E. Fogel, Chun-Yung Sung, Haizhou Yin 2011-06-14
7923337 Fin field effect transistor devices with self-aligned source and drain regions Josephine B. Chang, Michael A. Guillorn, Wilfried E. Haensch 2011-04-12
7914619 Thick epitaxial silicon by grain reorientation annealing and applications thereof Joel P. de Souza, Keith E. Fogel, Daniel A. Inns, Devendra K. Sadana 2011-03-29
7887711 Method for etching chemically inert metal oxides Douglas A. Buchanan, Eduard A. Cartier, Evgeni Gousev, Harald Okorn-Schmidt 2011-02-15
7868410 Gate stack engineering by electrochemical processing utilizing through-gate-dielectric current flow Philippe M. Vereecken, Veeraraghavan S. Basker, Cyril Cabral, Jr., Emanuel I. Cooper, Hariklia Deligianni +4 more 2011-01-11
7863712 Hybrid orientation semiconductor structure with reduced boundary defects and method of forming same Haizhou Yin, John A. Ott, Chun-Yung Sung 2011-01-04
7851288 Field effect transistor using carbon based stress liner Alfred Grill, Son V. Nguyen 2010-12-14
7811906 Carbon-on-insulator substrates by in-place bonding Ageeth A. Bol, Jack O. Chu, Alfred Grill, Conal E. Murray 2010-10-12
7795677 Nanowire field-effect transistors Sarunya Bangsaruntip, Guy M. Cohen 2010-09-14
7785982 Structures containing electrodeposited germanium and methods for their fabrication Stephen W. Bedell, Hariklia Deligianni, Qiang Huang, Lubomyr T. Romankiw, Devendra K. Sadana 2010-08-31
7785939 Planar substrate with selected semiconductor crystal orientations formed by localized amorphization and recrystallization of stacked template layers Joel P. de Souza, John A. Ott, Alexander Reznicek 2010-08-31
7745863 Flip FERAM cell and method to form same James W. Adkisson, Charles T. Black, Alfred Grill, Randy W. Mann, Deborah A. Neumayer +2 more 2010-06-29
7704852 Amorphization/templated recrystallization method for hybrid orientation substrates Keith E. Fogel, Chun-Yung Sung, Haizhou Yin 2010-04-27