Issued Patents All Time
Showing 426–450 of 584 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7445966 | Method and structure for charge dissipation during fabrication of integrated circuits and isolation thereof | John J. Ellis-Monaghan, Timothy D. Sullivan, Steven H. Voldman | 2008-11-04 |
| 7439170 | Design structure for final via designs for chip stress reduction | Timothy H. Daubenspeck, Wolfgang Sauter, David L. Questad | 2008-10-21 |
| 7427550 | Methods of fabricating passive element without planarizing | Anil K. Chinthakindi, Timothy J. Dalton, Ebenezer E. Eshun, Anthony K. Stamper, Kunal Vaed | 2008-09-23 |
| 7410894 | Post last wiring level inductor using patterned plate process | Anil K. Chinthakindi, Douglas D. Coolbaugh, John E. Florkey, Zhong-Xiang He, Anthony K. Stamper +1 more | 2008-08-12 |
| 7411135 | Contour structures to highlight inspection regions | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter | 2008-08-12 |
| 7405147 | Device and methodology for reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, John A. Fitzsimmons +10 more | 2008-07-29 |
| 7405139 | Prevention of backside cracks in semiconductor chips or wafers using backside film or backside wet etch | Timothy H. Daubenspeck, Jerome B. Lasky, Christopher D. Muzzy, Wolfgang Sauter | 2008-07-29 |
| 7405152 | Reducing wire erosion during damascene processing | Anthony K. Stamper | 2008-07-29 |
| 7394145 | Methods of fabricating passive element without planarizing and related semiconductor device | Anil K. Chinthakindi, Timothy J. Dalton, Ebenezer E. Eshun, Anthony K. Stamper, Kunal Vaed | 2008-07-01 |
| 7394110 | Planar vertical resistor and bond pad resistor | Douglas D. Coolbaugh, Timothy J. Dalton, Daniel C. Edelstein, Ebenezer E. Eshun, Kevin S. Petrarca +2 more | 2008-07-01 |
| 7381627 | Dual wired integrated circuit chips | Kerry Bernstein, Timothy J. Dalton, Mark D. Jaffe, Paul D. Kartschoke, Anthony K. Stamper | 2008-06-03 |
| 7375039 | Local plasma processing | Thomas L. McDevitt, Anthony K. Stamper | 2008-05-20 |
| 7365412 | Vertical parallel plate capacitor using spacer shaped electrodes and method for fabrication thereof | Timothy J. Dalton, Anthony K. Stamper | 2008-04-29 |
| 7361581 | High surface area aluminum bond pad for through-wafer connections to an electronic package | James W. Adkisson, Mark D. Jaffe, Richard J. Rassel, Edmund J. Sprogis | 2008-04-22 |
| 7361989 | Stacked imager package | James W. Adkisson, Mark D. Jaffe, Robert K. Leidy, Stephen E. Luce, Richard J. Rassel +1 more | 2008-04-22 |
| 7348210 | Post bump passivation for soft error protection | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter, Edmund J. Sprogis | 2008-03-25 |
| 7342268 | CMOS imager with Cu wiring and method of eliminating high reflectivity interfaces therefrom | James W. Adkisson, Mark D. Jaffe, Robert K. Leidy, Richard J. Rassel, Anthony K. Stamper | 2008-03-11 |
| 7335577 | Crack stop for low K dielectrics | Timothy H. Daubenspeck, Stephen E. Luce, Thomas L. McDevitt, William T. Motsiff, Mark J. Pouliot +1 more | 2008-02-26 |
| 7329951 | Solder bumps in flip-chip technologies | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter | 2008-02-12 |
| 7327033 | Copper alloy via bottom liner | Daniel C. Edelstein, Edward C. Cooney, III, John A. Fitzsimmons, Anthony K. Stamper | 2008-02-05 |
| 7323780 | Electrical interconnection structure formation | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter | 2008-01-29 |
| 7316940 | Chip dicing | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter | 2008-01-08 |
| 7316971 | Wire bond pads | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter | 2008-01-08 |
| 7315066 | Protect diodes for hybrid-orientation substrate structures | James W. Atkisson, Alain Loiseau, Kirk D. Peterson | 2008-01-01 |
| 7309653 | Method of forming damascene filament wires and the structure so formed | Brent A. Anderson, Andres Bryant, Anthony K. Stamper | 2007-12-18 |