Issued Patents All Time
Showing 401–425 of 584 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7585722 | Integrated circuit comb capacitor | Daniel C. Edelstein, Anil K. Chinthakindi, Timothy J. Dalton, Ebenezer E. Eshun, Sarah L. Lane +1 more | 2009-09-08 |
| 7586139 | Photo-sensor and pixel array with backside illumination and method of forming the photo-sensor | James W. Adkisson, Mark D. Jaffe, Alan Loiseau, Richard J. Rassel | 2009-09-08 |
| 7573117 | Post last wiring level inductor using patterned plate process | Anil K. Chinthakindi, Douglas D. Coolbaugh, John E. Florkey, Zhong-Xiang He, Anthony K. Stamper +1 more | 2009-08-11 |
| 7560778 | Charge modulation network for multiple power domains for silicon-on-insulator technology | David Cain, Norman J. Rohrer, Daryl M. Seltzer, Steven H. Voldman | 2009-07-14 |
| 7547576 | Solder wall structure in flip-chip technologies | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter | 2009-06-16 |
| 7545050 | Design structure for final via designs for chip stress reduction | Timothy H. Daubenspeck, Wolfgang Sauter, David L. Questad | 2009-06-09 |
| 7541272 | Damascene patterning of barrier layer metal for C4 solder bumps | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter | 2009-06-02 |
| 7541679 | Exposed pore sealing post patterning | Edward C. Cooney, III, John A. Fitzsimmons, Stephen E. Luce, Thomas L. McDevitt, Lee M. Nicholson +1 more | 2009-06-02 |
| 7537951 | Image sensor including spatially different active and dark pixel interconnect patterns | Mark D. Jaffe, Robert K. Leidy, Richard J. Rassel | 2009-05-26 |
| 7528048 | Planar vertical resistor and bond pad resistor and related method | Douglas D. Coolbaugh, Timothy J. Dalton, Daniel C. Edelstein, Ebenezer E. Eshun, Kevin S. Petrarca +2 more | 2009-05-05 |
| 7528427 | Pixel sensor cell having asymmetric transfer gate with reduced pinning layer barrier potential | Mark D. Jaffe | 2009-05-05 |
| 7524694 | Funneled light pipe for pixel sensors | James W. Adkisson, Robert K. Leidy, Richard J. Rassel | 2009-04-28 |
| 7521287 | Wire and solder bond forming methods | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter | 2009-04-21 |
| 7521798 | Stacked imager package | James W. Adkisson, Mark D. Jaffe, Robert K. Leidy, Stephen E. Luce, Richard J. Rassel +1 more | 2009-04-21 |
| 7521336 | Crack stop for low K dielectrics | Timothy H. Daubenspeck, Stephen E. Luce, Thomas L. McDevitt, William T. Motsiff, Mark J. Pouliot +1 more | 2009-04-21 |
| 7517789 | Solder bumps in flip-chip technologies | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter | 2009-04-14 |
| 7500208 | Non-destructive evaluation of microstructure and interface roughness of electrically conducting lines in semiconductor integrated circuits in deep sub-micron regime | Fen Chen, Jason P. Gill, Baozhen Li, Timothy D. Sullivan | 2009-03-03 |
| 7491992 | Image sensor cells | James W. Adkisson, John J. Ellis-Monaghan, Mark D. Jaffe, Richard J. Rassel | 2009-02-17 |
| 7492048 | CMOS sensors having charge pushing regions | James W. Adkisson, Mark D. Jaffe, Jeffrey B. Johnson, Jerome B. Lasky, Richard J. Rassel | 2009-02-17 |
| 7485564 | Undercut-free BLM process for Pb-free and Pb-reduced C4 | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter | 2009-02-03 |
| 7482675 | Probing pads in kerf area for wafer testing | James W. Adkisson, Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter | 2009-01-27 |
| 7474104 | Wafer-to-wafer alignments | Thomas Joseph Dalton, Mark David Jaffee, Stephen E. Luce, Edmund J. Sprogis | 2009-01-06 |
| 7462509 | Dual-sided chip attached modules | Kerry Bernstein, Timothy J. Dalton, Timothy H. Daubenspeck, Mark D. Jaffe, Christopher D. Muzzy +3 more | 2008-12-09 |
| 7459360 | Method of forming pixel sensor cell having reduced pinning layer barrier potential | James W. Adkisson, Andres Bryant, John J. Ellis-Monaghan, Mark D. Jaffe, Jerome B. Lasky +1 more | 2008-12-02 |
| 7459785 | Electrical interconnection structure formation | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter | 2008-12-02 |