Issued Patents All Time
Showing 51–68 of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7439170 | Design structure for final via designs for chip stress reduction | Timothy H. Daubenspeck, Wolfgang Sauter, Jeffrey P. Gambino | 2008-10-21 |
| 7329816 | Electronic package with optimized lamination process | Donald S. Farquhar, James D. Herard, Michael Joseph Klodowski, Der-jin Woan | 2008-02-12 |
| 7319591 | Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packages | Jeffrey T. Coffin, Michael A. Gaynes, Kamal K. Sikka, Hilton T. Toy, Jamil A. Wakil | 2008-01-15 |
| 7312523 | Enhanced via structure for organic module performance | Jean Audet, Jon A. Casey, Luc Guerin, David J. Russell | 2007-12-25 |
| 7256503 | Chip underfill in flip-chip technologies | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2007-08-14 |
| 7059049 | Electronic package with optimized lamination process | Donald S. Farquhar, James D. Herard, Michael Joseph Klodowski, Der-jin Woan | 2006-06-13 |
| 6979782 | Apparatus and method for mechanical coupling of land grid array applications | William L. Brodsky | 2005-12-27 |
| 6815346 | Unique feature design enabling structural integrity for advanced low k semiconductor chips | Charles R. Davis, David L. Hawken, Dae Young Jung, William Francis Landers | 2004-11-09 |
| 6650010 | Unique feature design enabling structural integrity for advanced low K semiconductor chips | Charles R. Davis, David L. Hawken, Dae Young Jung, William Francis Landers | 2003-11-18 |
| 6607613 | Solder ball with chemically and mechanically enhanced surface properties | Frank D. Egitto, Edmond O. Fey, Luis J. Matienzo, Rajinder S. Rai, Daniel C. Van Hart | 2003-08-19 |
| 6348738 | Flip chip assembly | Jean Dery, Frank D. Egitto, Luis J. Matienzo, Charles Ouellet, Luc Ouellet +2 more | 2002-02-19 |
| 6306683 | Method of forming a flip chip assembly, and a flip chip assembly formed by the method | Jean Dery, Frank D. Egitto, Luis J. Matienzo, Charles Ouellet, Luc Ouellet +2 more | 2001-10-23 |
| 6226187 | Integrated circuit package | Anne Marie Quinn, George H. Thiel, Donna Jean Trevitt, Tien Y. Wu, Patrick Robert Zippetelli | 2001-05-01 |
| 6210547 | Enhanced solder surface and process for chemically and mechanically enhancing solder surface properties | Frank D. Egitto, Edmond O. Fey, Luis J. Matienzo, Rajinder S. Rai, Daniel C. Van Hart | 2001-04-03 |
| 6084299 | Integrated circuit package including a heat sink and an adhesive | Anne Marie Quinn, George H. Thiel, Donna Jean Trevitt, Tien Y. Wu, Patrick Robert Zippetelli | 2000-07-04 |
| 6074895 | Method of forming a flip chip assembly | Jean Dery, Frank D. Egitto, Luis J. Matienzo, Charles Ouellet, Luc Ouellet +2 more | 2000-06-13 |
| 6056831 | Process for chemically and mechanically enhancing solder surface properties | Frank D. Egitto, Edmond O. Fey, Luis J. Matienzo, Rajinder S. Rai, Daniel C. Van Hart | 2000-05-02 |
| 5872337 | Chip carrier and cable assembly reinforced at edges | Donald S. Farquhar, Stephen Joseph Fuerniss, Charles R. Davis, Darbha Suryanarayana, Jeffrey Zimmerman | 1999-02-16 |