Issued Patents All Time
Showing 476–500 of 633 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7592685 | Device and methodology for reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, John A. Fitzsimmons +10 more | 2009-09-22 |
| 7585722 | Integrated circuit comb capacitor | Daniel C. Edelstein, Anil K. Chinthakindi, Timothy J. Dalton, Ebenezer E. Eshun, Jeffrey P. Gambino +1 more | 2009-09-08 |
| 7585758 | Interconnect layers without electromigration | Stephen E. Luce, Thomas L. McDevitt | 2009-09-08 |
| 7573117 | Post last wiring level inductor using patterned plate process | Anil K. Chinthakindi, Douglas D. Coolbaugh, John E. Florkey, Jeffrey P. Gambino, Zhong-Xiang He +1 more | 2009-08-11 |
| 7566946 | Precision passive circuit structure | Douglas D. Coolbaugh, Hayden C. Cranford, Jr., Terence B. Hook | 2009-07-28 |
| 7563714 | Low resistance and inductance backside through vias and methods of fabricating same | Mete Erturk, Robert A. Groves, Jeffrey B. Johnson, Alvin J. Joseph, Qizhi Liu +1 more | 2009-07-21 |
| 7541679 | Exposed pore sealing post patterning | Edward C. Cooney, III, John A. Fitzsimmons, Jeffrey P. Gambino, Stephen E. Luce, Thomas L. McDevitt +1 more | 2009-06-02 |
| 7538006 | Annular damascene vertical natural capacitor | Felix P. Anderson, Thomas L. McDevitt | 2009-05-26 |
| 7528048 | Planar vertical resistor and bond pad resistor and related method | Douglas D. Coolbaugh, Timothy J. Dalton, Daniel C. Edelstein, Ebenezer E. Eshun, Jeffrey P. Gambino +2 more | 2009-05-05 |
| 7517802 | Method for reducing foreign material concentrations in etch chambers | Edward C. Cooney, III | 2009-04-14 |
| 7501690 | Semiconductor ground shield method | Mete Erturk, Alvin J. Joseph | 2009-03-10 |
| 7494748 | Method for correction of defects in lithography masks | James W. Adkisson, Eric M. Coker, Christopher K. Magg, Jed H. Rankin | 2009-02-24 |
| 7494912 | Terminal pad structures and methods of fabricating same | Douglas D. Coolbaugh, Daniel C. Edelstein, Ebenezer E. Eshun, Zhong-Xiang He, Robert M. Rassel | 2009-02-24 |
| 7492016 | Protection against charging damage in hybrid orientation transistors | Terence B. Hook, Anda C. Mocuta, Jeffrey W. Sleight | 2009-02-17 |
| 7485540 | Integrated BEOL thin film resistor | Anil K. Chinthakindi, Douglas D. Coolbaugh, John M. Cotte, Ebenezer E. Eshun, Zhong-Xiang He +1 more | 2009-02-03 |
| 7468320 | Reduced electromigration and stressed induced migration of copper wires by surface coating | Chao-Kun Hu, Robert Rosenberg, Judith M. Rubino, Carlos J. Sambucetti | 2008-12-23 |
| 7462509 | Dual-sided chip attached modules | Kerry Bernstein, Timothy J. Dalton, Timothy H. Daubenspeck, Jeffrey P. Gambino, Mark D. Jaffe +3 more | 2008-12-09 |
| 7459389 | Method of forming a semiconductor device having air gaps and the structure so formed | — | 2008-12-02 |
| 7456074 | Increasing an electrical resistance of a resistor by nitridization | Arne Ballantine, Daniel C. Edelstein | 2008-11-25 |
| 7439151 | Method and structure for integrating MIM capacitors within dual damascene processing techniques | Douglas D. Coolbaugh, Timothy J. Dalton, Ebenezer E. Eshun, Vincent J. McGahay, Kunal Vaed | 2008-10-21 |
| 7427550 | Methods of fabricating passive element without planarizing | Anil K. Chinthakindi, Timothy J. Dalton, Ebenezer E. Eshun, Jeffrey P. Gambino, Kunal Vaed | 2008-09-23 |
| 7410894 | Post last wiring level inductor using patterned plate process | Anil K. Chinthakindi, Douglas D. Coolbaugh, John E. Florkey, Jeffrey P. Gambino, Zhong-Xiang He +1 more | 2008-08-12 |
| 7405147 | Device and methodology for reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, John A. Fitzsimmons +10 more | 2008-07-29 |
| 7405152 | Reducing wire erosion during damascene processing | Jeffrey P. Gambino | 2008-07-29 |
| 7399696 | Method for high performance inductor fabrication using a triple damascene process with copper BEOL | Douglas D. Coolbaugh, Mete Erturk, Zhong-Xiang He | 2008-07-15 |