Issued Patents All Time
Showing 501–525 of 633 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7394110 | Planar vertical resistor and bond pad resistor | Douglas D. Coolbaugh, Timothy J. Dalton, Daniel C. Edelstein, Ebenezer E. Eshun, Jeffrey P. Gambino +2 more | 2008-07-01 |
| 7393777 | Sacrificial metal spacer damascene process | Edward C. Cooney, III, Robert M. Geffken | 2008-07-01 |
| 7394145 | Methods of fabricating passive element without planarizing and related semiconductor device | Anil K. Chinthakindi, Timothy J. Dalton, Ebenezer E. Eshun, Jeffrey P. Gambino, Kunal Vaed | 2008-07-01 |
| 7381637 | Metal spacer in single and dual damascence processing | Edward C. Cooney, III, Robert M. Geffken | 2008-06-03 |
| 7382055 | Integrated thin-film resistor with direct contact | Eric M. Coker, Douglas D. Coolbaugh, Ebenezer E. Eshun, Zhong-Xiang He, Matthew D. Moon | 2008-06-03 |
| 7381627 | Dual wired integrated circuit chips | Kerry Bernstein, Timothy J. Dalton, Jeffrey P. Gambino, Mark D. Jaffe, Paul D. Kartschoke | 2008-06-03 |
| 7375039 | Local plasma processing | Jeffrey P. Gambino, Thomas L. McDevitt | 2008-05-20 |
| 7365412 | Vertical parallel plate capacitor using spacer shaped electrodes and method for fabrication thereof | Timothy J. Dalton, Jeffrey P. Gambino | 2008-04-29 |
| 7361950 | Integration of a MIM capacitor with a plate formed in a well region and with a high-k dielectric | Anil K. Chinthakindi, Douglas D. Coolbaugh, Keith E. Downes, Ebenezer E. Eshun, Zhong-Xiang He +2 more | 2008-04-22 |
| 7361993 | Terminal pad structures and methods of fabricating same | Douglas D. Coolbaugh, Daniel C. Edelstein, Ebenezer E. Eshun, Zhong-Xiang He, Robert M. Rassel | 2008-04-22 |
| 7351639 | Increasing an electrical resistance of a resistor by oxidation or nitridization | Arne Ballantine, Daniel C. Edelstein | 2008-04-01 |
| 7342268 | CMOS imager with Cu wiring and method of eliminating high reflectivity interfaces therefrom | James W. Adkisson, Jeffrey P. Gambino, Mark D. Jaffe, Robert K. Leidy, Richard J. Rassel | 2008-03-11 |
| 7327033 | Copper alloy via bottom liner | Daniel C. Edelstein, Edward C. Cooney, III, John A. Fitzsimmons, Jeffrey P. Gambino | 2008-02-05 |
| 7309653 | Method of forming damascene filament wires and the structure so formed | Brent A. Anderson, Andres Bryant, Jeffrey P. Gambino | 2007-12-18 |
| 7310036 | Heat sink for integrated circuit devices | Douglas D. Coolbaugh, Ebenezer E. Eshun, Terence B. Hook, Robert M. Rassel, Edmund J. Sprogis +1 more | 2007-12-18 |
| 7303972 | Integrated thin-film resistor with direct contact | Eric M. Coker, Douglas D. Coolbaugh, Ebenezer E. Eshun, Zhong-Xiang He, Matthew D. Moon | 2007-12-04 |
| 7303994 | Process for interfacial adhesion in laminate structures through patterned roughing of a surface | Edward C. Cooney, III, Vincent J. McGahay, Thomas M. Shaw, Matthew E. Colburn | 2007-12-04 |
| 7300867 | Dual damascene interconnect structures having different materials for line and via conductors | Jeffrey P. Gambino, Edward C. Cooney, III, William T. Motsiff, Michael Lane, Andrew H. Simon | 2007-11-27 |
| 7300807 | Structure and method for providing precision passive elements | Douglas D. Coolbaugh, Hayden C. Cranford, Jr., Terence B. Hook | 2007-11-27 |
| 7288475 | Sacrificial inorganic polymer intermetal dielectric damascene wire and via liner | Jeffrey P. Gambino | 2007-10-30 |
| 7285477 | Dual wired integrated circuit chips | Kerry Bernstein, Timothy J. Dalton, Jeffrey P. Gambino, Mark D. Jaffe, Paul D. Kartschoke | 2007-10-23 |
| 7285474 | Air-gap insulated interconnections | Brent A. Anderson, Andres Bryant, Jeffrey P. Gambino | 2007-10-23 |
| 7271699 | Changing an electrical resistance of a resistor | Arne Ballantine, Cyril Cabral, Jr., Daniel C. Edelstein | 2007-09-18 |
| 7239006 | Resistor tuning | Douglas D. Coolbaugh, Ebenezer E. Eshun, Robert M. Rassel | 2007-07-03 |
| 7230336 | Dual damascene copper interconnect to a damascene tungsten wiring level | Charlotte DeWan Adams | 2007-06-12 |