Issued Patents All Time
Showing 551–575 of 633 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6958540 | Dual damascene interconnect structures having different materials for line and via conductors | Jeffrey P. Gambino, Edward C. Cooney, III, William T. Motsiff, Michael Lane, Andrew H. Simon | 2005-10-25 |
| 6939791 | Contact capping local interconnect | Robert M. Geffken, David V. Horak | 2005-09-06 |
| 6924555 | Specially shaped contact via and integrated circuit therewith | John Cronin | 2005-08-02 |
| 6914320 | Bilayer HDP CVD/PE CVD cap in advanced BEOL interconnect structures and method thereof | Tze-Chiang Chen, Brett H. Engel, John A. Fitzsimmons, Terence L. Kane, Naftall E. Lustig +5 more | 2005-07-05 |
| 6888251 | Metal spacer in single and dual damascene processing | Edward C. Cooney, III, Robert M. Geffken | 2005-05-03 |
| 6887783 | Bilayer HDP CVD/PE CVD cap in advance BEOL interconnect structures and method thereof | Tze-Chiang Chen, Brett H. Engel, John A. Fitzsimmons, Terence L. Kane, Naftall E. Lustig +5 more | 2005-05-03 |
| 6862799 | Method for changing an electrical resistance of a resistor | Arne Ballantine, Cyril Cabral, Jr., Daniel C. Edelstein | 2005-03-08 |
| 6858889 | Polysilicon capacitor having large capacitance and low resistance | James W. Adkisson, John A. Bracchitta, Jed H. Rankin | 2005-02-22 |
| 6846741 | Sacrificial metal spacer damascene process | Edward C. Cooney, III, Robert M. Geffken | 2005-01-25 |
| 6838355 | Damascene interconnect structures including etchback for low-k dielectric materials | Edward C. Cooney, III, Jeffrey P. Gambino, Timothy J. Dalton, John A. Fitzsimmons, Lee M. Nicholson | 2005-01-04 |
| 6833720 | Electrical detection of dicing damage | Timothy H. Daubenspeck, Jeffrey P. Gambino, Thomas L. McDevitt | 2004-12-21 |
| 6822472 | Detection of hard mask remaining on a surface of an insulating layer | Sanjit Das, Eric J. White | 2004-11-23 |
| 6797610 | Sublithographic patterning using microtrenching | Jeffrey P. Gambino, Peter J. Lindgren | 2004-09-28 |
| 6779711 | Self-aligned corrosion stop for copper C4 and wirebond | Daniel C. Edelstein, Judith M. Rubino, Carlos J. Sambucetti | 2004-08-24 |
| 6770501 | Deuterium reservoirs and ingress paths | Jay Burnham, Eduard A. Cartier, Thomas G. Ference, Steven W. Mittl | 2004-08-03 |
| 6750114 | One-mask metal-insulator-metal capacitor and method for forming same | Eric Adler | 2004-06-15 |
| 6746947 | Post-fuse blow corrosion prevention structure for copper fuses | Timothy H. Daubenspeck, Daniel C. Edelstein, Robert M. Geffken, William T. Motsiff, Steven H. Voldman | 2004-06-08 |
| 6734564 | Specially shaped contact via and integrated circuit therewith | John Cronin | 2004-05-11 |
| 6730984 | Increasing an electrical resistance of a resistor by oxidation or nitridization | Arne Ballantine, Daniel C. Edelstein | 2004-05-04 |
| 6680520 | Method and structure for forming precision MIM fusible circuit elements using fuses and antifuses | Steven H. Voldman | 2004-01-20 |
| 6680514 | Contact capping local interconnect | Robert M. Geffken, David V. Horak | 2004-01-20 |
| 6677678 | Damascene structure using a sacrificial conductive layer | Peter Biolsi, Gregory S. Jankowski, Laurie M. Krywanczyk | 2004-01-13 |
| 6674168 | Single and multilevel rework | Edward C. Cooney, III, Robert M. Geffken, Vincent J. McGahay, William T. Motsiff, Mark P. Murray +4 more | 2004-01-06 |
| 6670255 | Method of fabricating lateral diodes and bipolar transistors | James W. Adkisson, Jeffrey P. Gambino, Peter B. Gray | 2003-12-30 |
| 6667533 | Triple damascene fuse | Timothy H. Daubenspeck, Thomas L. McDevitt, William T. Motsiff | 2003-12-23 |