Issued Patents All Time
Showing 601–625 of 633 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6436814 | Interconnection structure and method for fabricating same | David V. Horak, William A. Klaasen, Thomas L. McDevitt, Mark P. Murray | 2002-08-20 |
| 6433429 | Copper conductive line with redundant liner and method of making | — | 2002-08-13 |
| 6429524 | Ultra-thin tantalum nitride copper interconnect barrier | Edward C. Cooney, III | 2002-08-06 |
| 6426249 | Buried metal dual damascene plate capacitor | Robert M. Geffken | 2002-07-30 |
| 6426558 | Metallurgy for semiconductor devices | Jonathan D. Chapple-Sokol, Paul M. Feeney, Robert M. Geffken, David V. Horak, Mark P. Murray | 2002-07-30 |
| 6420254 | Recessed bond pad | Sally J. Yankee | 2002-07-16 |
| 6403393 | Device having integrated optical and copper conductors and method of fabricating same | James W. Adkisson, Paul W. Pastel | 2002-06-11 |
| 6384468 | Capacitor and method for forming same | Kerry Bernstein, Nicholas Theodore Schmidt, Stephen A. St. Onge, Steven H. Voldman | 2002-05-07 |
| 6368903 | SOI low capacitance body contact | Andres Bryant, Randy W. Mann | 2002-04-09 |
| 6362531 | Recessed bond pad | Sally J. Yankee | 2002-03-26 |
| 6342733 | Reduced electromigration and stressed induced migration of Cu wires by surface coating | Chao-Kun Hu, Robert Rosenberg, Judith M. Rubino, Carlos J. Sambucetti | 2002-01-29 |
| 6339022 | Method of annealing copper metallurgy | Arne Ballantine, Edward C. Cooney, III, George A. Dunbar, III, Cheryl G. Faltermeier, Jeffrey D. Gilbert +9 more | 2002-01-15 |
| 6331481 | Damascene etchback for low .epsilon. dielectric | Vincent J. McGahay | 2001-12-18 |
| 6319818 | Pattern factor checkerboard for planarization | — | 2001-11-20 |
| 6310300 | Fluorine-free barrier layer between conductor and insulator for degradation prevention | Edward C. Cooney, III, Hyun Koo Lee, Thomas L. McDevitt | 2001-10-30 |
| 6303456 | Method for making a finger capacitor with tuneable dielectric constant | Wilbur D. Pricer | 2001-10-16 |
| 6297149 | Methods for forming metal interconnects | — | 2001-10-02 |
| 6261895 | Polysilicon capacitor having large capacitance and low resistance and process for forming the capacitor | James W. Adkisson, John A. Bracchitta, Jed H. Rankin | 2001-07-17 |
| 6261951 | Plasma treatment to enhance inorganic dielectric adhesion to copper | Leena Paivikki Buchwalter, Barbara Luther, Paul D. Agnello, John P. Hummel, Terence L. Kane +3 more | 2001-07-17 |
| 6255217 | Plasma treatment to enhance inorganic dielectric adhesion to copper | Paul D. Agnello, Leena Paivikki Buchwalter, John P. Hummel, Barbara Luther | 2001-07-03 |
| 6236103 | Integrated high-performance decoupling capacitor and heat sink | Kerry Bernstein, Robert M. Geffken, Wilbur D. Pricer, Steven H. Voldman | 2001-05-22 |
| 6214730 | Fluorine barrier layer between conductor and insulator for degradation prevention | Edward C. Cooney, III, Hyun Koo Lee, Thomas L. McDevitt | 2001-04-10 |
| 6111301 | Interconnection with integrated corrosion stop | — | 2000-08-29 |
| 6104079 | Closely pitched polysilicon fuses and method of forming the same | — | 2000-08-15 |
| 6066577 | Method for providing fluorine barrier layer between conductor and insulator for degradation prevention | Edward C. Cooney, III, Hyun Koo Lee, Thomas L. McDevitt | 2000-05-23 |