Issued Patents All Time
Showing 26–50 of 103 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7989343 | Method of depositing a uniform metal seed layer over a plurality of recessed semiconductor features | Tony P. Chiang, Gongda Yao, Fusen Chen, Barry Chin, Gene Y. Kohara +2 more | 2011-08-02 |
| 7884032 | Thin film deposition | Mengqi Ye, Hougong Wang, Zhendong Liu | 2011-02-08 |
| 7807030 | Small scanned magentron | Ilyoung Richard Hong, James Tsung, Daniel C. Lubben, Nirmalya Maity | 2010-10-05 |
| 7795138 | Method of depositing a metal seed layer over recessed feature surfaces in a semiconductor substrate | Tony P. Chiang, Gongda Yao, Fusen Chen, Barry Chin, Gene Y. Kohara +2 more | 2010-09-14 |
| 7749361 | Multi-component doping of copper seed layer | Jie Chen, Suraj Rengarajan, Ling Chen, Tram Vo | 2010-07-06 |
| 7687909 | Metal / metal nitride barrier layer for semiconductor device applications | Zheng Xu, Hong Mei Zhang, Xianmin Tang, Praburam Gopalraja, Suraj Rengarajan +7 more | 2010-03-30 |
| 7674360 | Mechanism for varying the spacing between sputter magnetron and target | Ilyoung Richard Hong, Donny Young, Michael Rosenstein, Robert B. Lowrance, Daniel C. Lubben +3 more | 2010-03-09 |
| 7589016 | Method of depositing a sculptured copper seed layer | Tony P. Chiang, Gongda Yao, Fusen Chen, Barry Chin, Gene Y. Kohara +2 more | 2009-09-15 |
| 7569125 | Shields usable with an inductively coupled plasma reactor | Tza-Jing Gung, Xianmin Tang, John C. Forster, Marc Schweitzer, Keith A. Miller +1 more | 2009-08-04 |
| 7381639 | Method of depositing a metal seed layer on semiconductor substrates | Tony P. Chiang, Gongda Yao, Fusen Chen, Barry Chin, Gene Y. Kohara +2 more | 2008-06-03 |
| 7294574 | Sputter deposition and etching of metallization seed layer for overhang and sidewall improvement | Fuhong Zhang, Hsien-Lung Yang, Michael Miller, Jianming Fu, Jick Yu +2 more | 2007-11-13 |
| 7253109 | Method of depositing a tantalum nitride/tantalum diffusion barrier layer system | Zheng Xu, Hong Mei Zhang, Xianmin Tang, Praburam Gopalraja, Suraj Rengarajan +7 more | 2007-08-07 |
| 7169271 | Magnetron executing planetary motion adjacent a sputtering target | Ilyoung Richard Hong, James Tsung, Daniel C. Lubben, Nirmalya Maity | 2007-01-30 |
| 7074714 | Method of depositing a metal seed layer on semiconductor substrates | Tony P. Chiang, Gongda Yao, Fusen Chen, Barry Chin, Gene Y. Kohara +2 more | 2006-07-11 |
| 7041201 | Sidewall magnet improving uniformity of inductively coupled plasma and shields used therewith | Tza-Jing Gung, Xianmin Tang, John C. Forster, Marc Schweitzer, Keith A. Miller +1 more | 2006-05-09 |
| 7014887 | Sequential sputter and reactive precleans of vias and contacts | Barney M. Cohen, Suraj Rengarajan, Xiangbing Li, Kenny King-Tai Ngan | 2006-03-21 |
| 6960284 | Rotational and reciprocal radial movement of a sputtering magnetron | Jianming Fu, Zheng Xu | 2005-11-01 |
| 6919275 | Method of preventing diffusion of copper through a tantalum-comprising barrier layer | Tony P. Chiang, Gongda Yao, Fusen Chen, Barry Chin, Gene Y. Kohara +2 more | 2005-07-19 |
| 6911124 | Method of depositing a TaN seed layer | Xianmin Tang, Praburam Gopalraja, Suraj Rengarajan, John C. Forster, Jianming Fu | 2005-06-28 |
| 6893541 | Multi-step process for depositing copper seed layer in a via | Tony P. Chiang, Yu D. Cong, Jianming Fu, Howard H. Tang, Anish Tolia | 2005-05-17 |
| 6887353 | Tailored barrier layer which provides improved copper interconnect electromigration resistance | Tony P. Chiang, Barry Chin | 2005-05-03 |
| 6881673 | Integrated deposition process for copper metallization | Imran Hashim, Barry Chin, Bingxi Sun | 2005-04-19 |
| 6875321 | Auxiliary magnet array in conjunction with magnetron sputtering | Rong Tao, Zheng Xu | 2005-04-05 |
| 6852202 | Small epicyclic magnetron with controlled radial sputtering profile | Michael Miller, James Tsung, Daniel C. Lubben, Ilyoung Richard Hong | 2005-02-08 |
| 6841050 | Small planetary magnetron | Ilyoung Richard Hong, James Tsung, Daniel C. Lubben, Nirmalya Maity | 2005-01-11 |