Issued Patents All Time
Showing 76–100 of 103 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6350353 | Alternate steps of IMP and sputtering process to improve sidewall coverage | Praburam Gopalraja, Sergio Edelstein, Avi Tepman, Debabrata Ghosh, Nirmalya Maity | 2002-02-26 |
| 6328871 | Barrier layer for electroplating processes | Tony P. Chiang, Tse-Yong Yao, Barry Chin | 2001-12-11 |
| 6313033 | Ionized metal plasma Ta, TaNx, W, and WNx liners for gate electrode applications | Tony P. Chiang, Bingxi Sun, Suraj Rengarajan, Barry Chin | 2001-11-06 |
| 6299689 | Reflow chamber and process | Hougong Wang, Steve Lai, Gongda Yao | 2001-10-09 |
| 6277198 | Use of tapered shadow clamp ring to provide improved physical vapor deposition system | Tse-Yong Yao, Allen Russell Thompson, Richard Hong | 2001-08-21 |
| 6235163 | Methods and apparatus for ionized metal plasma copper deposition with enhanced in-film particle performance | Darryl Angelo, Arvind Sundarrajan, James Tsung, Ilyoung Richard Hong, Barry Chin | 2001-05-22 |
| 6232665 | Silicon-doped titanium wetting layer for aluminum plug | Gongda Yao, Zheng Xu, Hoa Kieu | 2001-05-15 |
| D440582 | Sputtering chamber coil | Praburam Gopalraja, Zheng Xu, Michael Rosenstein, John C. Forster | 2001-04-17 |
| 6207558 | Barrier applications for aluminum planarization | Shri Singhvi, Suraj Rengarajan, Gongda Yao | 2001-03-27 |
| 6200433 | IMP technology with heavy gas sputtering | Rong Tao, Barry Chin, Dan Carl | 2001-03-13 |
| 6193811 | Method for improved chamber bake-out and cool-down | Arvind Sundarrajan, Dinesh Saigal, James Van Gogh | 2001-02-27 |
| 6184137 | Structure and method for improving low temperature copper reflow in semiconductor features | Imran Hashim, Barry Chin | 2001-02-06 |
| 6174811 | Integrated deposition process for copper metallization | Imran Hashim, Barry Chin, Bingxi Sun | 2001-01-16 |
| 6160315 | Copper alloy via structure | Tony P. Chiang, Barry Chin, Imran Hashim, Bingxi Sun | 2000-12-12 |
| 6149776 | Copper sputtering target | Howard H. Tang, Imran Hashim, Richard Hong | 2000-11-21 |
| 6139699 | Sputtering methods for depositing stress tunable tantalum and tantalum nitride films | Tony P. Chiang, Barry Chin | 2000-10-31 |
| 6110821 | Method for forming titanium silicide in situ | Gene Y. Kohara, Fusen Chen, Hyman J. Levinstein, Zheng Xu, Gongda Yao +1 more | 2000-08-29 |
| 6077404 | Reflow chamber and process | Hougong Wang, Steve Lai, Gongda Yao | 2000-06-20 |
| 6066892 | Copper alloy seed layer for copper metallization in an integrated circuit | Tony P. Chiang, Imran Hashim, Bingxi Sun, Barry Chin | 2000-05-23 |
| 6057223 | Passivated copper conductive layers for microelectronic applications | William A. Lanford, Wei Wang | 2000-05-02 |
| 6057237 | Tantalum-containing barrier layers for copper | Tony P. Chiang | 2000-05-02 |
| 6037257 | Sputter deposition and annealing of copper alloy metallization | Tony P. Chiang, Barry Chin, Imran Hashim, Bingxi Sun | 2000-03-14 |
| 5959358 | Oxidation resistant high conductivity copper layers for microelectronic applications and process of making same | William A. Lanford | 1999-09-28 |
| 5911113 | Silicon-doped titanium wetting layer for aluminum plug | Gongda Yao, Zheng Xu, Hoa Kieu | 1999-06-08 |
| 5879523 | Ceramic coated metallic insulator particularly useful in a plasma sputter reactor | Hougong Wang | 1999-03-09 |