Issued Patents All Time
Showing 51–75 of 103 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6793779 | Sputtering method for filling holes with copper | Tony P. Chiang, Barry Chin | 2004-09-21 |
| 6790776 | Barrier layer for electroplating processes | Tony P. Chiang, Tse-Yong Yao, Barry Chin | 2004-09-14 |
| 6758947 | Damage-free sculptured coating deposition | Tony P. Chiang, Gongda Yao, Fusen Chen, Barry Chin, Gene Y. Kohara +2 more | 2004-07-06 |
| 6692617 | Sustained self-sputtering reactor having an increased density plasma | Jianming Fu, Zheng Xu | 2004-02-17 |
| 6627050 | Method and apparatus for depositing a tantalum-containing layer on a substrate | Michael Miller, Howard H. Tang, Tony P. Chiang, Jianming Fu | 2003-09-30 |
| 6610184 | Magnet array in conjunction with rotating magnetron for plasma sputtering | Rong Tao, Zheng Xu | 2003-08-26 |
| 6607640 | Temperature control of a substrate | Arvind Sundarrajan, Darryl Angelo, Tse-Yong Yao | 2003-08-19 |
| 6605197 | Method of sputtering copper to fill trenches and vias | Tony P. Chiang, Barry Chin | 2003-08-12 |
| 6582569 | Process for sputtering copper in a self ionized plasma | Tony P. Chiang, Yu D. Cong, Jianming Fu, Howard H. Tang, Anish Tolia | 2003-06-24 |
| 6580057 | Enhanced cooling IMP coil support | Richard Hong, James Tsung, Gunnar Vatvedt, Arvind Sundarrajan | 2003-06-17 |
| 6579730 | Monitoring process for oxide removal | Haojiang Li, Suraj Rengarajan | 2003-06-17 |
| 6566259 | Integrated deposition process for copper metallization | Imran Hashim, Barry Chin, Bingxi Sun | 2003-05-20 |
| 6506287 | Overlap design of one-turn coil | — | 2003-01-14 |
| 6488823 | Stress tunable tantalum and tantalum nitride films | Tony P. Chiang, Barry Chin, Bingxi Sun | 2002-12-03 |
| 6458251 | Pressure modulation method to obtain improved step coverage of seed layer | Arvind Sundarrajan, Darryl Angelo, Barry Chin, Imran Hasim | 2002-10-01 |
| 6458255 | Ultra-low resistivity tantalum films and methods for their deposition | Tony P. Chiang, Barry Chin | 2002-10-01 |
| 6436267 | Method for achieving copper fill of high aspect ratio interconnect features | Daniel Carl, Barry Chin, Liang-Yuh Chen, Robin Cheung, Yezdi Dordi +3 more | 2002-08-20 |
| 6413383 | Method for igniting a plasma in a sputter reactor | Tony P. Chiang, Yu D. Cong, Jianming Fu, Howard H. Tang, Anish Tolia | 2002-07-02 |
| 6399479 | Processes to improve electroplating fill | Fusen Chen, Zheng Xu, Barry Chin, Ashok Sinha | 2002-06-04 |
| 6398929 | Plasma reactor and shields generating self-ionized plasma for sputtering | Tony P. Chiang, Yu D. Cong, Jianming Fu, Howard H. Tang, Anish Tolia | 2002-06-04 |
| 6387805 | Copper alloy seed layer for copper metallization | Tony P. Chiang, Imran Hashim, Bingxi Sun, Barry Chin | 2002-05-14 |
| 6375743 | Method for improved chamber bake-out and cool-down | Arvind Sundarrajan, Dinesh Saigal | 2002-04-23 |
| 6376807 | Enhanced cooling IMP coil support | Richard Hong, James Tsung, Gunnar Vatvedt, Arvind Sundarrajan | 2002-04-23 |
| 6368880 | Barrier applications for aluminum planarization | Shri Singhvi, Suraj Rengarajan, Gongda Yao | 2002-04-09 |
| 6352926 | Structure for improving low temperature copper reflow in semiconductor features | Imran Hashim, Barry Chin | 2002-03-05 |