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Applied Materials: 1 patents #4,780 of 7,310Top 70%
Overall (All Time): #3,294,434 of 4,157,543Top 80%
1
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
7749361 Multi-component doping of copper seed layer Jie Chen, Peijun Ding, Suraj Rengarajan, Ling Chen 2010-07-06