Issued Patents 2024
Showing 26–45 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12009256 | Redistribution lines with protection layers and method forming same | Wen-Hsiung Lu, Chin Wei Kang, Yung-Han Chuang, Lung-Kai Mao, Yung-Sheng Lin | 2024-06-11 |
| 11990440 | Structure and formation method of semiconductor device with conductive bumps | Hui-Min Huang, Wei-Hung Lin, Chang-Jung Hsueh, Kai Jun Zhan, Yung-Sheng Lin | 2024-05-21 |
| 11978720 | Semiconductor device package and methods of manufacture | Kai Jun Zhan, Chin-Fu Kao, Kuang-Chun Lee, Chen-Shien Chen | 2024-05-07 |
| 11967579 | Method for forming package structure with cavity substrate | Po-Hao Tsai, Mirng-Ji Lii | 2024-04-23 |
| 11961791 | Package structures and methods for forming the same | Ching-Wen Hsiao, Chih-Wei Lin, Chen-Shien Chen, Chih-Hua Chen, Chen-Cheng Kuo | 2024-04-16 |
| 11961944 | Semiconductor device and manufacturing method thereof | Chen-En Yen, Mirng-Ji Lii, Wen-Hsiung Lu, Cheng-Jen Lin, Chin Wei Kang +1 more | 2024-04-16 |
| 11961817 | Apparatus and method for forming a package structure | Kai Jun Zhan, Chang-Jung Hsueh, Hui-Min Huang, Wei-Hung Lin | 2024-04-16 |
| 11961762 | Package component with stepped passivation layer | Tzy-Kuang Lee, Song-Bor Lee, Wen-Hsiung Lu, Po-Hao Tsai, Wen-Che Chang | 2024-04-16 |
| 11955423 | Semiconductor device and method | Ting-Li Yang, Po-Hao Tsai, Yung-Han Chuang, Hsueh-Sheng Wang | 2024-04-09 |
| 11955460 | Advanced info POP and method of forming thereof | Yi-Da Tsai, Meng-Tse Chen, Sheng-Feng Weng, Sheng-Hsiang Chiu, Wei-Hung Lin +2 more | 2024-04-09 |
| 11942445 | Semiconductor device with conductive pad | Chen-En Yen, Chin Wei Kang, Kai Jun Zhan, Wen-Hsiung Lu, Cheng-Jen Lin +1 more | 2024-03-26 |
| 11935826 | Capacitor between two passivation layers with different etching rates | Chia-Ming Huang, Songbor Lee, Jung-You Chen, Ching-Hua Kuan, Tzy-Kuang Lee | 2024-03-19 |
| 11923326 | Bump structure and method of manufacturing bump structure | Ching-Yu Chang, Ming-Hui Weng | 2024-03-05 |
| 11901319 | Semiconductor package system and method | Hui-Min Huang, Chih-Wei Lin, Tsai-Tsung Tsai, Chung-Shi Liu, Chen-Hua Yu | 2024-02-13 |
| 11901323 | Semiconductor packages having conductive pillars with inclined surfaces | Chiang-Jui Chu, Ching-Wen Hsiao, Hao-Chun Liu, Young-Hwa Wu, Tao-Sheng Chang | 2024-02-13 |
| 11901256 | Semiconductor device, semiconductor package, and methods of manufacturing the same | Chang-Jung Hsueh, Cheng-Nan Lin, Wan-Yu Chiang, Wei-Hung Lin, Ching-Wen Hsiao | 2024-02-13 |
| 11894332 | Substrate and package structure | Wei-Hung Lin, Hsiu-Jen Lin, Yu-Min Liang, Chen-Shien Chen, Chung-Shi Liu | 2024-02-06 |
| 11894241 | Heterogeneous bonding structure and method forming same | Mirng-Ji Lii, Chen-Shien Chen, Lung-Kai Mao, Wen-Hsiung Lu | 2024-02-06 |
| 11887955 | Semiconductor die including stress-resistant bonding structures and methods of forming the same | Hui-Min Huang, Chang-Jung Hsueh, Wei-Hung Lin, Kai Jun Zhan, Wan-Yu Chiang | 2024-01-30 |
| 11862588 | Semiconductor device and method | Chen-Shien Chen, Ting-Li Yang, Po-Hao Tsai, Chien-Chen Li | 2024-01-02 |