Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040381 | Method of manufacturing semiconductor devices and semiconductor devices | Cheng-Yi Peng, Wen-Yuan Chen, Wen-Hsing Hsieh, Yi-Ju Hsu, Jon-Hsu Ho +1 more | 2024-07-16 |
| 11990510 | Semiconductor device and manufacturing method thereof | Cheng-Yi Peng, Ting TSAI, Chung-Wei HUNG, Jung-Ting Chen, Ying-Hua LAI +1 more | 2024-05-21 |
| 11961762 | Package component with stepped passivation layer | Ming-Da Cheng, Tzy-Kuang Lee, Wen-Hsiung Lu, Po-Hao Tsai, Wen-Che Chang | 2024-04-16 |
| 11929422 | Passivation layers for semiconductor devices | Cheng-Yi Peng, Ching-Hua Lee | 2024-03-12 |
| 11881530 | Spacer structures for semiconductor devices | Cheng-Yi Peng | 2024-01-23 |