Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051622 | Passivation layer and planarization layer and method of forming the same | Ming-Da Cheng, Hao-Chun Liu, Po-Hao Tsai, Chih-Hsien Lin, Ching-Wen Hsiao | 2024-07-30 |
| 11961762 | Package component with stepped passivation layer | Ming-Da Cheng, Song-Bor Lee, Wen-Hsiung Lu, Po-Hao Tsai, Wen-Che Chang | 2024-04-16 |
| 11935826 | Capacitor between two passivation layers with different etching rates | Chia-Ming Huang, Ming-Da Cheng, Songbor Lee, Jung-You Chen, Ching-Hua Kuan | 2024-03-19 |