CL

Chih-Hsien Lin

TSMC: 1 patents #2,264 of 4,162Top 55%
📍 Tainan, TW: #299 of 783 inventorsTop 40%
Overall (2024): #509,731 of 561,600Top 95%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12051622 Passivation layer and planarization layer and method of forming the same Ming-Da Cheng, Tzy-Kuang Lee, Hao-Chun Liu, Po-Hao Tsai, Ching-Wen Hsiao 2024-07-30