Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11901323 | Semiconductor packages having conductive pillars with inclined surfaces | Ching-Wen Hsiao, Hao-Chun Liu, Ming-Da Cheng, Young-Hwa Wu, Tao-Sheng Chang | 2024-02-13 |
CC
Chiang-Jui Chu
Overall (2024): #514,812 of 561,600Top 95%
1
Patents 2024