Issued Patents 2023
Showing 26–50 of 69 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784130 | Structure and formation method of package with underfill | Yu-Sheng Lin, Po-Yao Lin, Chin-Hua Wang, Shu-Shen Yeh, Che-Chia Yang | 2023-10-10 |
| 11764159 | Package with fan-out structures | Po-Hao Tsai, Po-Yao Chuang, Techi Wong | 2023-09-19 |
| 11756854 | Package structure and method of fabricating the same | Yu-Sheng Lin, Po-Yao Lin, Shu-Shen Yeh, Chin-Hua Wang | 2023-09-12 |
| 11756928 | Multi-chip packages | Shuo-Mao Chen, Feng-Cheng Hsu, Han-Hsiang Huang, Hsien-Wen Liu, Hsiao-Wen Lee | 2023-09-12 |
| 11756892 | Method for forming chip package structure | Shuo-Mao Chen, Feng-Cheng Hsu, Po-Yao Lin | 2023-09-12 |
| 11756873 | Semiconductor package and manufacturing method thereof | Chia-Kuei Hsu, Ming-Chih Yew, Tsung-Yen Lee, Po-Yao Lin | 2023-09-12 |
| 11749644 | Semiconductor device with curved conductive lines and method of forming the same | Chia-Kuei Hsu, Ming-Chih Yew, Shu-Shen Yeh, Che-Chia Yang, Po-Yao Lin | 2023-09-05 |
| 11742220 | Integrated passive device package and methods of forming same | Feng-Cheng Hsu, Shuo-Mao Chen, Jui-Pin Hung | 2023-08-29 |
| 11742298 | Alignment mark design for packages | Li-Hsien Huang, Hsien-Wei Chen, Ching-Wen Hsiao, Der-Chyang Yeh, Chen-Hua Yu | 2023-08-29 |
| 11742322 | Integrated fan-out package having stress release structure | Ming-Chih Yew, Po-Chen Lai, Shu-Shen Yeh, Po-Yao Lin | 2023-08-29 |
| 11735572 | Integrated circuit package and method forming same | Shuo-Mao Chen, Feng-Cheng Hsu | 2023-08-22 |
| 11728284 | Chip package structure and method for forming the same | Po-Chen Lai, Chin-Hua Wang, Ming-Chih Yew, Chia-Kuei Hsu, Li-Ling Liao +1 more | 2023-08-15 |
| 11728256 | Reinforcing package using reinforcing patches | Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Shuo-Mao Chen, Feng-Cheng Hsu | 2023-08-15 |
| 11728233 | Chip package structure with ring structure and method for forming the same | Shu-Shen Yeh, Po-Yao Lin, Po-Chen Lai, Kuang-Chun Lee, Che-Chia Yang +2 more | 2023-08-15 |
| 11721643 | Package structure | Po-Chen Lai, Chin-Hua Wang, Ming-Chih Yew, Che-Chia Yang, Shu-Shen Yeh +1 more | 2023-08-08 |
| 11721644 | Semiconductor package with riveting structure between two rings and method for forming the same | Chien-Hung Chen, Shu-Shen Yeh, Po-Chen Lai, Po-Yao Lin | 2023-08-08 |
| 11715731 | Package structure and method of forming the same | Po-Yao Lin, Shu-Shen Yeh, Chin-Hua Wang, Yu-Sheng Lin | 2023-08-01 |
| 11705406 | Package structure and method for forming the same | Po-Chen Lai, Chin-Hua Wang, Ming-Chih Yew, Li-Ling Liao, Tsung-Yen Lee +1 more | 2023-07-18 |
| 11699668 | Semiconductor device package having warpage control and method of forming the same | Shu-Shen Yeh, Che-Chia Yang, Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin | 2023-07-11 |
| 11699631 | Semiconductor device and manufacturing method thereof | Shu-Shen Yeh, Po-Yao Lin, Hui Yu, Shyue-Ter Leu | 2023-07-11 |
| 11694974 | Semiconductor die with warpage release layer structure in package and fabricating method thereof | Chin-Hua Wang, Kuang-Chun Lee, Shu-Shen Yeh, Tsung-Yen Lee, Po-Yao Lin | 2023-07-04 |
| 11694941 | Semiconductor die package with multi-lid structures and method for forming the same | Shu-Shen Yeh, Che-Chia Yang, Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin | 2023-07-04 |
| 11682599 | Chip package structure with molding layer and method for forming the same | Po-Hao Tsai, Techi Wong, Meng-Wei Chou, Meng-Liang Lin, Po-Yao Chuang | 2023-06-20 |
| 11682602 | Semiconductor device and method of manufacture | Shu-Shen Yeh, Chin-Hua Wang, Chia-Kuei Hsu, Po-Yao Lin | 2023-06-20 |
| 11682593 | Interposer test structures and methods | Tzuan-Horng Liu, Chen-Hua Yu, Hsien-Pin Hu, Tzu-Yu Wang, Wei-Cheng Wu +1 more | 2023-06-20 |