Issued Patents 2023
Showing 51–69 of 69 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11676916 | Structure and formation method of package with warpage-control element | Yu-Sheng Lin, Chien-Hung Chen, Po-Chen Lai, Po-Yao Lin | 2023-06-13 |
| 11676826 | Semiconductor die package with ring structure for controlling warpage of a package substrate | Yu-Sheng Lin, Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin | 2023-06-13 |
| 11670601 | Stacking via structures for stress reduction | Shu-Shen Yeh, Che-Chia Yang, Chin-Hua Wang, Po-Yao Lin, Chia-Hsiang Lin | 2023-06-06 |
| 11670577 | Chip package with redistribution structure having multiple chips | Po-Hao Tsai, Po-Yao Chuang, Feng-Cheng Hsu, Shuo-Mao Chen, Techi Wong | 2023-06-06 |
| 11652037 | Semiconductor package and method of manufacture | Chia-Kuei Hsu, Ming-Chih Yew, Po-Chen Lai, Shu-Shen Yeh, Po-Yao Lin | 2023-05-16 |
| 11646256 | Heterogeneous fan-out structure and method of manufacture | Po-Hao Tsai, Po-Yao Chuang, Techi Wong | 2023-05-09 |
| 11637087 | Multi-chip device and method of formation | Chin-Hua Wang, Po-Chen Lai, Shu-Shen Yeh, Tsung-Yen Lee, Po-Yao Lin | 2023-04-25 |
| 11637054 | Semiconductor package and method of manufacturing the same | Shih-Ting Hung, Meng-Liang Lin, Yi-Wen Wu, Po-Yao Chuang | 2023-04-25 |
| 11610835 | Organic interposer including intra-die structural reinforcement structures and methods of forming the same | Li-Ling Liao, Ming-Chih Yew, Chia-Kuei Hsu, Shu-Shen Yeh, Po-Yao Lin | 2023-03-21 |
| 11610864 | Chip package structure and method of forming the same | Shuo-Mao Chen, Feng-Cheng Hsu | 2023-03-21 |
| 11610854 | Semiconductor device and method of manufacture | Po-Hao Tsai, Po-Yao Chuang, Ming-Chih Yew | 2023-03-21 |
| 11605600 | Package structure with reinforced element and formation method thereof | Po-Yao Lin, Shuo-Mao Chen, Chia-Hsiang Lin | 2023-03-14 |
| 11600575 | Method for forming chip package structure | Techi Wong, Po-Yao Lin, Ming-Chih Yew, Po-Hao Tsai, Po-Yao Chuang | 2023-03-07 |
| 11600597 | Semiconductor package structure | Feng-Cheng Hsu | 2023-03-07 |
| 11600573 | Structure and formation method of chip package with conductive support elements to reduce warpage | Po-Hao Tsai, Techi Wong, Yi-Wen Wu, Po-Yao Chuang | 2023-03-07 |
| 11594477 | Semiconductor package and method of manufacturing semiconductor package | Chia-Kuei Hsu, Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin | 2023-02-28 |
| 11594520 | Semiconductor package for thermal dissipation | Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Cheng-Chieh Hsieh, Ming-Yen Chiu | 2023-02-28 |
| 11574861 | Semiconductor package | Chin-Hua Wang, Shu-Shen Yeh, Yu-Sheng Lin, Po-Yao Lin | 2023-02-07 |
| 11557559 | Package structure | Tsung-Yen Lee, Chin-Hua Wang, Ming-Chih Yew, Po-Yao Lin | 2023-01-17 |