Issued Patents 2023
Showing 26–43 of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11664287 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chih-Fan Huang, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2023-05-30 |
| 11658134 | Inductor structure, semiconductor package and fabrication method thereof | Chih-Yuan Chang, Jiun Yi Wu, Chien-Hsun Lee, Chen-Hua Yu | 2023-05-23 |
| 11658392 | Package structure | Nan-Chin Chuang, Chen-Hua Yu, Chao-Wen Shih, Shou-Zen Chang | 2023-05-23 |
| 11658085 | Integrated circuit package and method | Chien-Hsun Chen, Yu-Ling Tsai, Jiun Yi Wu, Chien-Hsun Lee | 2023-05-23 |
| 11646255 | Chip package structure including a silicon substrate interposer and methods for forming the same | Kuo Lung Pan, Yu-Chia Lai, Tin-Hao Kuo, Hao-Yi Tsai, Chen-Hua Yu +3 more | 2023-05-09 |
| 11640935 | Semiconductor package and manufacturing method thereof | Chung-Ming Weng, Chen-Hua Yu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo +7 more | 2023-05-02 |
| 11635566 | Package and method of forming same | Chih-Hsuan Tai, Chung-Ming Weng, Hung-Yi Kuo, Cheng-Chieh Hsieh, Hao-Yi Tsai +1 more | 2023-04-25 |
| 11631658 | Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device | Yu-Chih Huang, Chi-Hui Lai, Ban-Li Wu, Ying-Cheng Tseng, Ting-Ting Kuo +5 more | 2023-04-18 |
| 11626339 | Integrated circuit package and method | Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Hao-Yi Tsai, Chi-Ming Tsai +2 more | 2023-04-11 |
| 11625940 | Fingerprint sensor device and method | Chen-Hua Yu, Yu-Feng Chen, Chih-Hua Chen, Hao-Yi Tsai | 2023-04-11 |
| 11614592 | Semiconductor devices and methods of manufacture | Chung-Ming Weng, Chen-Hua Yu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo +4 more | 2023-03-28 |
| 11602056 | Circuit board and semiconductor device including the same | Jiun Yi Wu, Chien-Hsun Lee, Chen-Hua Yu | 2023-03-07 |
| 11594498 | Semiconductor package and method | Jiun Yi Wu, Chen-Hua Yu | 2023-02-28 |
| 11594484 | Forming bonding structures by using template layer as templates | Mirng-Ji Lii, Chin-Yu Ku, Hung-Jui Kuo, Alexander Kalnitsky, Ming-Che Ho +3 more | 2023-02-28 |
| 11569202 | Semiconductor device, circuit board structure and manufacturing method thereof | Tin-Hao Kuo, Chen-Hua Yu, Hao-Yi Tsai, Yu-Chia Lai, Po-Yuan Teng | 2023-01-31 |
| 11569183 | Package structure and method of fabricating the same | Cheng-Yu Kuo, Ching-Hua Hsieh, Chen-Hua Yu, Yi-Yang Lei, Wei Huang | 2023-01-31 |
| 11551999 | Memory device and manufacturing method thereof | Lipu Kris Chuang, Han-Ping Pu, Hsin-Yu Pan, Ming-Kai Liu, Ting-Chu Ko | 2023-01-10 |
| 11545465 | 3D package structure and methods of forming same | Meng-Tse Chen, Chih-Wei Lin, Hui-Min Huang, Hsuan-Ting Kuo, Ming-Da Cheng | 2023-01-03 |