Issued Patents 2019
Showing 26–50 of 154 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510650 | Method of manufacturing semiconductor device packaging structure having through interposer vias and through substrate vias | Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Tzuan-Horng Liu | 2019-12-17 |
| 10510717 | Chip on package structure and method | Der-Chyang Yeh, Kuo-Chung Yee, Jui-Pin Hung | 2019-12-17 |
| 10510660 | Semiconductor package devices integrated with inductor | Wei-Ting Chen, In-Tsang Lin, Vincent Chen, Chuei-Tang Wang | 2019-12-17 |
| 10510670 | Pad structure design in fan-out package | Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen | 2019-12-17 |
| 10510674 | Fan-out package having a main die and a dummy die, and method of forming | Yan-Fu Lin, Meng-Tsan Lee, Wei-Cheng Wu, Hsien-Wei Chen | 2019-12-17 |
| 10510715 | Semiconductor structure and manufacturing method thereof | Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, An-Jhih Su, Tien-Chung Yang | 2019-12-17 |
| 10510645 | Planarizing RDLs in RDL-first processes through CMP process | Po-Han Wang, Yu-Hsiang Hu, Hung-Jui Kuo | 2019-12-17 |
| 10510699 | Bond structures and the methods of forming the same | Wen-Chih Chiou, Ming-Fa Chen, Yi-Hsiu Chen | 2019-12-17 |
| 10510630 | Molding structure for wafer level package | Chung-Shi Liu, Chih-Fan Huang, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2019-12-17 |
| 10510710 | Bump-on-trace interconnect | Chen-Shien Chen | 2019-12-17 |
| 10510701 | Semiconductor die connection system and method | Ming-Fa Chen, Sen-Bor Jan | 2019-12-17 |
| 10510629 | Integrated circuit package and method of forming same | Hsien-Wei Chen, Ming-Fa Chen | 2019-12-17 |
| 10510698 | Semiconductor structure and method of forming | Yu-Hsiang Hu, Hung-Jui Kuo | 2019-12-17 |
| 10510719 | Methods of packaging semiconductor devices and packaged semiconductor devices | Chung-Shi Liu, Meng-Tse Chen, Hui-Min Huang, Chih-Fan Huang, Ming-Da Cheng | 2019-12-17 |
| 10510604 | Semiconductor device and method | Hung-Pin Chang, Yi-Hsiu Chen, Ku-Feng Yang, Wen-Chih Chiou | 2019-12-17 |
| 10509938 | Fingerprint sensor device and method | Yu-Feng Chen, Chih-Hua Chen, Hao-Yi Tsai, Chung-Shi Liu | 2019-12-17 |
| 10504835 | Package structure, semiconductor chip and method of fabricating the same | Chuei-Tang Wang, Chung-Hao Tsai, Wei-Ting Chen | 2019-12-10 |
| 10504877 | Surface mount device/integrated passive device on package or device structure and methods of forming | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chi-Hsi Wu, Der-Chyang Yeh, Wei-Cheng Wu | 2019-12-10 |
| 10504810 | Polymer-based-semiconductor structure with cavity | Hung-Yi Kuo, Hao-Yi Tsai | 2019-12-10 |
| 10497616 | Embedded 3D interposer structure | Ying-Ching Shih, Jing-Cheng Lin, Wen-Chih Chiou, Shin-Puu Jeng | 2019-12-03 |
| 10497668 | Integrated fan-out package including voltage regulators and methods forming same | Chih-Yuan Chang, Chuei-Tang Wang, Jeng-Shien Hsieh | 2019-12-03 |
| 10498009 | 3D antenna for integrated circuits | Jeng-Shien Hsieh, Chung-Hao Tsai, Chuei-Tang Wang | 2019-12-03 |
| 10497619 | Method of manufacturing a semiconductor device including through silicon plugs | Chia-Lin Yu, Hung-Pin Chang, Chien Ling Hwang, Jui-Pin Hung, Yung-Chi Lin | 2019-12-03 |
| 10490540 | Multi-stack package-on-package structures | An-Jhih Su | 2019-11-26 |
| 10481351 | Semicondcutor packages | Chuei-Tang Wang, Jeng-Shien Hsieh, Hsing-Kuo Hsia | 2019-11-19 |