Issued Patents All Time
Showing 176–200 of 498 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9748198 | Hybrid bonding systems and methods for semiconductor wafers | Ping-Yin Liu, Shih-Wei Lin, Xin-Hua Huang, Lan-Lin Chao | 2017-08-29 |
| 9741681 | Debonding schemes | Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Lan-Lin Chao | 2017-08-22 |
| 9738516 | Structure to reduce backside silicon damage | Chung-Yen Chou, Chih-Jen Chan, Ru-Liang Lee, Yuan-Chih Hsieh | 2017-08-22 |
| 9728719 | Leakage resistant RRAM/MIM structure | Ming Chyi Liu, Yuan-Tai Tseng, Shih-Chang Liu | 2017-08-08 |
| 9728597 | Metal-insulator-metal structure and method for forming the same | Hsing-Lien Lin, Cheng-Yuan Tsai, Huey-Chi Chu, Hai-Dang Trinh, Wen-Chuan Chiang +1 more | 2017-08-08 |
| 9728453 | Methods for hybrid wafer bonding integrated with CMOS processing | Pin-Nan Tseng, Ping-Yin Liu | 2017-08-08 |
| 9722011 | Film scheme for MIM device | Hsing-Lien Lin, Yao-Wen Chang, Cheng-Yuan Tsai | 2017-08-01 |
| 9711555 | Dual facing BSI image sensors with wafer level stacking | Ping-Yin Liu, Yeur-Luen Tu, Xiaomeng Chen, Pin-Nan Tseng | 2017-07-18 |
| 9704820 | Semiconductor manufacturing method and associated semiconductor manufacturing system | Xin-Hua Huang, Yung-Lung Lin, Ping-Yin Liu | 2017-07-11 |
| 9685518 | Method of forming semiconductor structure of control gate, and semiconductor device | Chih-Ming Chen, Chin-Cheng Chang, Szu-Yu Wang, Chung-Yi Yu, Ru-Liang Lee | 2017-06-20 |
| 9679980 | Common source oxide formation by in-situ steam oxidation for embedded flash | Yu-Hung Cheng, Cheng-Ta Wu, Yeur-Luen Tu, Ru-Liang Lee, I-Ting Li +1 more | 2017-06-13 |
| 9679979 | Semiconductor structure for flash memory cells and method of making same | Ming Chyi Liu, Chang-Ming Wu, Shih-Chang Liu, Wei-Cheng Wu, Harry-Hak-Lay Chuang +1 more | 2017-06-13 |
| 9673205 | Embedded nonvolatile memory and forming method thereof | Chang-Ming Wu, Wei-Cheng Wu, Yuan-Tai Tseng, Shih-Chang Liu, Ru-Liang Lee +1 more | 2017-06-06 |
| 9660063 | Semiconductor structure having sets of III-V compound layers and method of forming the same | Chi-Ming Chen, Po-Chun Liu, Chung-Yi Yu | 2017-05-23 |
| 9653507 | Deep trench isolation shrinkage method for enhanced device performance | Cheng-Hsien Chou, Shih Pei Chou, Chih-Yu Lai, Sheng-Chau Chen, Chih-Ta Chen +1 more | 2017-05-16 |
| 9647207 | Resistive random access memory (RRAM) structure | Hai-Dang Trinh, Chin-Wei Liang, Cheng-Yuan Tsai, Hsing-Lien Lin, Chin-Chieh Yang +1 more | 2017-05-09 |
| 9637375 | MEMS device having a getter structure and method of forming the same | Chin-Wei Liang, Cheng-Yuan Tsai | 2017-05-02 |
| 9634105 | Silicon nano-tip thin film for flash memory cells | Tsu-Hui Su, Chih-Ming Chen, Chung-Yi Yu, Szu-Yu Wang | 2017-04-25 |
| 9634096 | Semiconductor device with trench isolation | Yu-Hung Cheng, Cheng-Ta Wu, Yeur-Luen Tu, Ru-Liang Lee, Tung-I Lin +1 more | 2017-04-25 |
| 9627467 | Thin film resistor integrated between interconnect levels and contacting an underlying dielectric layer protrusion | Yuan-Tai Tseng, Ming Chyi Liu, Chung-Yen Chou | 2017-04-18 |
| 9627243 | Method and apparatus of holding a device | Ping-Yin Liu, Chung-Yi Yu, Che Ying Hsu, Yeur-Luen Tu, Da-Hsiang Chou | 2017-04-18 |
| 9620372 | HK embodied flash memory and methods of forming the same | Ming Chyi Liu, Wei-Hang Huang, Yu-Hsing Chang, Chang-Ming Wu, Wei-Cheng Wu +3 more | 2017-04-11 |
| 9614145 | Reversed stack MTJ | Wei-Hang Huang, Fu-Ting Sung, Chern-Yow Hsu, Shih-Chang Liu | 2017-04-04 |
| 9611141 | Self-removal anti-stiction coating for bonding process | Ping-Yin Liu, Li-Cheng Chu, Hung-Hua Lin, Shang-Ying Tsai, Yuan-Chih Hsieh +3 more | 2017-04-04 |
| 9608195 | Magnetic tunnel junction device | Wei-Hang Huang, Chern-Yow Hsu, Shih-Chang Liu | 2017-03-28 |