Issued Patents All Time
Showing 151–175 of 498 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9944516 | High aspect ratio etch without upper widening | Chung-Yen Chou, Lee-Chuan Tseng, Ru-Liang Lee | 2018-04-17 |
| 9941320 | 3DIC interconnect apparatus and method | Shih Pei Chou, Hung-Wen Hsu, Ching-Chung Su, Chun-Han Tsao, Chia-Chieh Lin +4 more | 2018-04-10 |
| 9929007 | e-Flash Si dot nitrogen passivation for trap reduction | Chih-Ming Chen, Tsu-Hui Su, Szu-Yu Wang, Chung-Yi Yu | 2018-03-27 |
| 9917069 | Hybrid bonding system and cleaning method thereof | Ping-Yin Liu, Yeong-Jyh Lin, Xin-Hua Huang | 2018-03-13 |
| 9911734 | Semiconductor device containing HEMT and MISFET and method of forming the same | Chung-Yen Chou, Sheng-De Liu, Fu-Chih Yang, Shih-Chang Liu | 2018-03-06 |
| 9887155 | Multiple metal layer semiconductor device and low temperature stacking method of fabricating the same | Ping-Yin Liu, Kai-Wen Cheng, Xin-Hua Huang, Lan-Lin Chao, Xiaomeng Chen | 2018-02-06 |
| 9876184 | Organic photosensitive device with an electron-blocking and hole-transport layer | Chin-Wei Liang, Hsing-Lien Lin, Cheng-Yuan Tsai | 2018-01-23 |
| 9876167 | High yield RRAM cell with optimized film scheme | Trinh Hai Dang, Hsing-Lien Lin, Cheng-Yuan Tsai, Chin-Chieh Yang, Yu-Wen Liao +1 more | 2018-01-23 |
| 9876093 | High electron mobility transistor and method of forming the same | Han-Chin Chiu, Chi-Ming Chen, Chung-Yi Yu | 2018-01-23 |
| 9865389 | Inductor structure with magnetic material | Yuan-Tai Tseng, Ming Chyi Liu, Chung-Yen Chou | 2018-01-09 |
| 9859295 | Method for forming flash memory structure | Fu-Ting Sung, Chung-Chiang Min, Wei-Hang Huang, Shih-Chang Liu | 2018-01-02 |
| 9853091 | Side bottom contact RRAM structure | Chung-Yen Chou, Ching-Pei Hsieh, Shih-Chang Liu | 2017-12-26 |
| 9837606 | Resistance variable memory structure and method of forming the same | Fu-Ting Sung, Ching-Pei Hsieh, Chern-Yow Hsu, Shih-Chang Liu | 2017-12-05 |
| 9837291 | Wafer processing method and apparatus | Chih-Hui Huang, Chun-Han Tsao, Sheng-Chau Chen, Yeur-Luen Tu, Xiaomeng Chen | 2017-12-05 |
| 9837605 | Memory cell having resistance variable film and method of making the same | Ching-Pei Hsieh, Fu-Ting Sung, Chern-Yow Hsu, Shih-Chang Liu | 2017-12-05 |
| 9837421 | Semiconductor arrangement having capacitor separated from active region | Chern-Yow Hsu, Cheng-Jong Wang, Shih-Chang Liu, Xiaomeng Chen | 2017-12-05 |
| 9825040 | Semiconductor arrangement with capacitor and method of fabricating the same | Chern-Yow Hsu, Ming Chyi Liu, Shih-Chang Liu, Xiaomeng Chen, Chen-Jong Wang | 2017-11-21 |
| 9825117 | MIM/RRAM structure with improved capacitance and reduced leakage current | Jian-Shiou Huang, Yao-Wen Chang, Hsing-Lien Lin, Cheng-Yuan Tsai | 2017-11-21 |
| 9793243 | Buffer layer(s) on a stacked structure having a via | Chen-Fa Lu, Cheng-Yuan Tsai, Yeur-Luen Tu | 2017-10-17 |
| 9786628 | Air trench in packages incorporating hybrid bonding | Bruce C. S. Chou, Chen-Jong Wang, Ping-Yin Liu, Jung-Kuo Tu, Tsung-Te Chou +4 more | 2017-10-10 |
| 9771256 | Micro electro mechanical system (MEMS) device having via extending through plug | Chung-Yen Chou, Lee-Chuan Tseng, Ru-Liang Lee | 2017-09-26 |
| 9768220 | Deep trench isolation structure for image sensors | Yuan-Tai Tseng, Yu-Hsing Chang, Ming Chyi Liu, Shih-Chang Liu | 2017-09-19 |
| 9754813 | Bond chuck, methods of bonding, and tool including bond chuck | Chih-Hui Huang, Yen-Chang Chu, Kuan-Liang Liu, Ping-Yin Liu, Cheng-Yuan Tsai +2 more | 2017-09-05 |
| 9748198 | Hybrid bonding systems and methods for semiconductor wafers | Ping-Yin Liu, Shih-Wei Lin, Xin-Hua Huang, Lan-Lin Chao | 2017-08-29 |
| 9748255 | Split gate memory devices and methods of manufacturing | Chang-Ming Wu, Shih-Chang Liu, Ru-Liang Lee | 2017-08-29 |