Issued Patents All Time
Showing 25 most recent of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400871 | Metal lines with low via-to-via spacing | Daniel James Dechene, Hsueh-Chung Chen, Carl Radens, Lawrence A. Clevenger | 2025-08-26 |
| 12394660 | Buried power rail after replacement metal gate | Devika Sarkar Grant, Sagarika Mukesh, Kisik Choi, Ruilong Xie | 2025-08-19 |
| 12268031 | Backside power rails and power distribution network for density scaling | Ruilong Xie, Kisik Choi, Sagarika Mukesh, Albert M. Chu, Albert M. Young +6 more | 2025-04-01 |
| 12148833 | Three-dimensional, monolithically stacked field effect transistors formed on the front and backside of a wafer | Sung-Dae Suk, Chen Zhang, Junli Wang, Devendra K. Sadana, Dechao Guo | 2024-11-19 |
| 12111624 | Healthy building dashboard facilitated by hierarchical model of building control assets | Bill Hughley, Sheeladitya Karmakar, Shahajahan Sheikh | 2024-10-08 |
| 12046511 | Selective metal residue and liner cleanse for post-subtractive etch | Devika Sarkar Grant | 2024-07-23 |
| 12020949 | Subtractive patterning of interconnect structures | Dominik Metzler, John C. Arnold, Ekmini Anuja De Silva | 2024-06-25 |
| 11990412 | Buried power rails located in a base layer including first, second, and third etch stop layers | Ruilong Xie, Stuart A. Sieg, Kisik Choi, Rishikesh Krishnan, Alexander Reznicek | 2024-05-21 |
| 11854884 | Fully aligned top vias | Nicholas Anthony Lanzillo, Koichi Motoyama, Christopher J. Penny, Robert R. Robison, Lawrence A. Clevenger | 2023-12-26 |
| 11830778 | Back-side wafer modification | David Wolpert, Daniel James Dechene, Lawrence A. Clevenger, Michael Romain | 2023-11-28 |
| 11815865 | Healthy building dashboard facilitated by hierarchical model of building control assets | Bill Hughley, Sheeladitya Karmakar, Shahajahan Sheikh | 2023-11-14 |
| 11817501 | Three-dimensional, monolithically stacked field effect transistors formed on the front and backside of a wafer | Sung-Dae Suk, Chen Zhang, Junli Wang, Devendra K. Sadana, Dechao Guo | 2023-11-14 |
| 11688636 | Spin on scaffold film for forming topvia | Karen E. Petrillo, Cody J. Murray, Ekmini Anuja De Silva, Chi-Chun Liu, Dominik Metzler +1 more | 2023-06-27 |
| 11682617 | High aspect ratio vias for integrated circuits | Nicholas Anthony Lanzillo, Lawrence A. Clevenger, Robert R. Robison | 2023-06-20 |
| 11662115 | Hierarchy model builder for building a hierarchical model of control assets | Bill Hughley, Mayur Salgar, Sheeladitya Karmakar, Shahajahan Sheikh | 2023-05-30 |
| 11599075 | Healthy building dashboard facilitated by hierarchical model of building control assets | Bill Hughley, Sheeladitya Karmakar, Shahajahan Sheikh | 2023-03-07 |
| 11527434 | Line cut patterning using sacrificial material | Timothy Mathew Philip, Daniel James Dechene, Robert R. Robison | 2022-12-13 |
| 11398378 | Metal on metal multiple patterning | Hsueh-Chung Chen, Ravi Prakash Srivastava, Nicholas V. LiCausi, Terry A. Spooner, Sean Reidy | 2022-07-26 |
| 11372383 | Healthy building dashboard facilitated by hierarchical model of building control assets | Bill Hughley, Sheeladitya Karmakar, Shahajahan Sheikh | 2022-06-28 |
| 11302571 | Cut integration for subtractive first metal line with bottom up second metal line | Hsueh-Chung Chen, Yongan Xu, Yann Mignot, Lawrence A. Clevenger | 2022-04-12 |
| 11270913 | BEOL metallization formation | Chanro Park, Kenneth Chun Kuen Cheng, Koichi Motoyama, Brent A. Anderson | 2022-03-08 |
| 11244897 | Back end of line metallization | Chanro Park, Koichi Motoyama, Kenneth Chun Kuen Cheng, Chih-Chao Yang | 2022-02-08 |
| 11217481 | Fully aligned top vias | Nicholas Anthony Lanzillo, Koichi Motoyama, Christopher J. Penny, Robert R. Robison, Lawrence A. Clevenger | 2022-01-04 |
| 11177160 | Double patterned lithography using spacer assisted cuts for patterning steps | Timothy Mathew Philip, Robert R. Robison | 2021-11-16 |
| 11158536 | Patterning line cuts before line patterning using sacrificial fill material | Daniel James Dechene, Timothy Mathew Philip, Robert R. Robison | 2021-10-26 |